ESI Receives Large Order from Leading North American Analog IC Manufacturer for Its Model 2100 Thin-Film Laser Trimming System; Multi-System Order Reinforces Continued Adoption of 2100 by Global Chip Manufacturers.

PORTLAND, Ore. -- ESI (Nasdaq:ESIO), a leading provider of world-class production laser systems for microengineering applications, today announced it has recently received an order from a leading North American analog integrated circuit (IC) manufacturer for its Model 2100 thin-film-on-silicon (TFOS) laser trimming systems. The quantity of tools included in the order numbered in the double-digits. ESI's patented 1.3-micron laser solution, integrated into its Model 2100, performs leading-edge laser trimming, enables significant process and throughput advantages, and has been qualified for manufacturing all of the customer's current and next-generation devices. The ESI customer will utilize the multiple 2100 systems to expand capacity at its North American facility, where it will begin accepting shipments over the next two quarters.

This multi-system order further highlights the growing demand for flexible and extendible systems that enable global chip manufacturers' product roadmaps. With the increasing popularity of consumer electronics, IC manufacturers require solutions that meet stringent technology parameters and deliver low-cost efficiencies to remain competitive. ESI's Model 2100 offers a revolutionary approach to thin-film trimming -- designed in cooperation with industry-leading prober manufacturers, it allows customers to integrate their TFOS solution with the tester and prober of their choice, thus realizing significant technology, flexibility and cost advantages.

ESI Director of Electronic Components Solutions Sean Phillips said, "The 2100's increased trim accuracy, coupled with our patented 1.3-micron wavelength solution, offers significant throughput advantages over competing systems. As a result, ESI has seen continued adoption of the 2100 system as chip manufacturers work to meet the demand for greater yield, while lowering overall costs. We are pleased to provide this valued customer with cost-effective systems that enable increases in their production capacity, while meeting their product and technology roadmaps."

The 2100 offers both a robust kinematic mount design for mating the trim head to the prober -- thus providing superior accuracy and vibration resistance -- and a standalone prober operation option on the trim head to provide maximum flexibility for manufacturers wrestling with changes in their production mix. The Model 2100 is available with ESI's patented 1.3-micron laser-trimming process or with the 1.0-micron laser option for customers with existing processes designed around that wavelength. The 1.3-micron wavelength enables significant improvements to the process window to greatly reduce the optoelectrical effects that plague standard laser-trimming processes. As a result, ESI's Model 2100 delivers significant throughput advantages over competing solutions, providing IC manufacturers with greater accuracy and increased throughput in a single, low-cost solution.

About ESI

ESI is a pioneer and leading supplier of world-class production laser systems that help its microelectronics customers achieve compelling yield and productivity gains. The company's industry-leading, application-specific products enhance electronic-device performance in three key sectors -- semiconductors, components and electronic interconnect -- by enabling precision fine-tuning of device microfeatures in high-volume manufacturing environments. Founded in 1944, ESI is headquartered in Portland, Ore. More information is available at www.esi.com.