ESI Introduces Model 5330 as the Fastest UV Laser Microvia Drilling System.Business Editors Japan Printed Circuit Association (JPCA JPCA Japan Petrochemical Industry Association ) TOKYO--(BUSINESS WIRE)--June 4, 2002 Electro Scientific Industries, Inc. (Nasdaq:ESIO ESIO Earth Sciences Information Office (Environmental Institute; University of Massachusetts) ) introduces the newest member of its drilling family, the Model 5330 Ultra Violet (UV) Laser Microvia Drill at JPCA 2002. The show runs June 5-7 at the Big Site Convention Center in Tokyo. Targeted at the high-density interconnect (HDI HDI Human Development Index (UNDP yardstick of human welfare) HDI Help Desk Institute HDI Humpty Dumpty Institute (New York, New York) HDI High Density Interconnect ) market and the integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for (IC) packaging market, the Model 5330 features a new higher-power diode-pumped laser that increases production throughput in IC packaging applications by more than 20%. The new system is designed in such a way that it delivers maximum throughput for via formation in copper for HDI as well as in non-reinforced dielectrics for IC packaging applications. The system is capable of generating via diameters as small as 25 microns. "New packaging designs being generated in Japan are requiring via diameter and pad size requirements to shrink significantly," said Bruce Goldwater, Director of ESI's Advanced Packaging Products. "CO2 is renowned for its high speed and throughput rates Throughput rate is an obsolete term[1] in the terminology of automated chemical analysis. It may mean either:
1. ^ International Union of Pure and Applied Chemistry. "throughput rate". , but it has difficulty drilling accurate vias smaller than 60 microns." The Model 5330 addresses the need to drill smaller vias with production acceptable throughput rates in both the HDI and IC packaging markets. Additionally, the system utilizes less floor space and utilities than any other laser drilling system in the world. The Model 5330 is the latest addition to the 5300 family of UV and CO2 laser drills, a platform that delivers high accuracy to +/- 10 microns. The 5300 family of laser drills have been designed to protect the manufacturer's initial capital investment through cost effective field upgrades. For example, the system architecture allows for the latest model laser, optical bench or galvanometer to be replaced at customer site as newer technology is introduced in the market. About ESI's Advanced Packaging Products ESI's Advanced Packaging Group (APG APG Assists Per Game (basketball) APG Assists Per Game (hockey statistic) APG Aberdeen Proving Ground APG Automated Password Generator APG Asia Pacific Group on Money Laundering ) product line provides innovative, cost effective via solutions to the high density interconnect (HDI) and advanced packaging markets. Anticipating design and production needs, APG continuously targets improved accuracy and production rates, while simultaneously providing solutions that enable customers to shrink pad design for increased density of the circuit board or electronic package. By offering complete via technology, regardless of drilling method deployed, ESI (Edge Side Includes) A markup language for Web pages that enables elements of a Web page to be dynamically assembled in servers distributed throughout the Internet. is committed to meeting the challenges of existing and emerging applications in integrated circuit (IC) packages, multi-chip modules A Multi-Chip Module or MCM is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other modules are packaged in such a way as to facilitate their use as a single IC. and high density printed wiring boards. About ESI ESI, headquartered in Portland, Oregon, supplies high-value, high-technology manufacturing equipment to the global electronics market. Using its expertise in laser/material interaction, small parts handling, machine vision and real-time control Real-time control is a popular term for a certain class of digital controllers. For effective digital control, it is critical that sample time be constant. Real-time control achieves nearly constant sample time. See also
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