ESI Enables Significant Productivity Increases for Leading-Edge Memory Repair with World's First Multiple-Beam IR Laser System.

PORTLAND, Ore. -- New Model 9850 with revolutionary dual-beam architecture is latest addition to ESI's arsenal of innovative, high-value solutions for its global customers

ESI, Inc. (Nasdaq:ESIO), a leading provider of world-class production laser systems for microengineering applications, today introduced the Model 9850 dual-beam infrared (IR) laser link-processing system for DRAM and NAND Flash memory applications. The 9850 features an innovative architecture that utilizes two beams from a single laser to enable the industries' first parallel processing capability. This new processing approach enables potential throughput improvements of up to 90% when compared with conventional laser repair systems, and improves cost of ownership by providing more productivity with no increase in maintenance or floor space requirements. ESI developed this unique laser architecture to meet the increasing demand and ramp for leading-edge DRAM devices. The company will be featuring the Model 9850 at next week's SEMICON(R) West exhibition in San Francisco.

ESI's 9850 dual-beam laser system leverages the company's state-of-the-art IR laser technology, through which customers have long realized precision, reliability and cost-of-ownership advantages. Now, memory manufacturers can deploy a new and unique processing approach that has evolved from an industry proven platform. With its new beam-positioning strategy that provides the ability to process many fuse design configurations at high speeds, the 9850 represents the first generation of ESI multiple-beam processing systems, which will be further enhanced to bring significant future gains in throughput and yield for ESI customers.

Paul Kirby, ESI's director of semiconductor link processing solutions, noted, "The 9850 was designed to enable customers to ramp production for 1Gb DRAM, and 2 and 4Gb NAND Flash memory applications. However, this is just the first step in determining the many applications for our new architecture -- we will be further developing this platform for other wavelengths and other laser types that stand to reap significant benefits from the dual-beam approach. ESI is committed to ongoing development of innovative, low cost-of-ownership solutions that anticipate evolving manufacturing requirements and deliver the advantages our customers need to improve their competitive edge."

The 9850 is the world's first multiple-beam delivery laser repair system. The system's innovative architecture processes tight-pitch metal fuses on the latest generation of DRAM and NAND Flash devices. Enabling whole-wafer processing with half the number of link runs, the 9850 was designed for high-throughput, automated 300mm production environments. In addition, the software automatically optimizes dual-beam processing for maximum throughput advantage.

To learn more about ESI's products, visit the company during SEMICON West at Booth #9311, in the West Hall at San Francisco's Moscone Convention Center. Editors interested in meeting with ESI during the show may contact Angie Kellen by phone: [phone] x120, or email: [e-mail].

About ESI, Inc.

ESI is a pioneer and leading supplier of world-class production laser systems that help its microelectronics customers achieve compelling yield and productivity gains. The company's industry-leading, application-specific products enhance electronic-device performance in three key sectors -- semiconductors, components and electronic interconnect -- by enabling precision fine-tuning of device microfeatures in high-volume manufacturing environments. Founded in 1944, ESI is headquartered in Portland, Ore. More information is available at www.esi.com.

SEMICON(R) is a registered trademark of Semiconductor Equipment and Materials International (SEMI).