EC PinPak Specification Developed For Component PinMap and Package Information; ChipData, Ericsson, Mentor Graphics and Valor Collaborate on Si2 Project.

Business Editors & High-Tech Writers

LAS VEGAS--(BUSINESS WIRE)--June 18, 2001

Silicon Integration Initiative Inc. (Si2), the leading open-source EDA standards consortium, announced and demonstrated today a new method for describing logic symbol PinMap and package dimension information at the Design Automation Conference in Las Vegas.

This new open specification, the EC PinPak(tm), was jointly developed by ChipData, Ericsson, Mentor Graphics and Valor in a Si2-managed project. EC PinPak provides one standard representation for encoding of information about a component sufficient for use by EDA and design-for-manufacturing (DFM) applications.

Key applications of EC PinPak include:

-- Automated logic symbol generation suitable for tool-specific design entry
applications

-- Component footprint generation suitable for place and route (layout and
wiring) applications

-- Solder mask and solder paste definitions

-- Land pattern definitions and

-- Component mechanical dimensions can be specified that support pick and place
machine applications in manufacturing

"EC PinPak will enable our XML-based software to quickly meet customer needs in the symbol and package data areas," said Kevin McDonough, president and CEO of ChipData. "In addition, ChipData will provide converters from the EC PinPak format to EDA tool-specific format where the design and manufacturing supply chain demands it."

Component manufacturers or information providers can now produce PinMap and Package information in one open industry standard format, rather than in multiple proprietary formats. EC PinPak instances may be converted into legacy formats for use in EDA tool-specific formats. However, the specification is being developed to enable EDA and DFM tools to use EC PinPak formats directly.

"This is exciting for us," said Ulf Holmberg, manager of technical services, Ericsson Radio Systems AB. "The EC PinPak specification enables us to meet key needs of our design team better, and it helps Ericsson to effectively interface with its many suppliers based on this new standard. Time-to-designer will be dramatically reduced as we drive towards adoption."

The EC PinPak project is an important follow-on to the Si2 Electronic Component Information eXchange (ECIX) project, which was completed last year. The ECIX QuickData specifications developed by Si2 have now been announced and adopted by RosettaNet, a consortium of over 400 companies, as the technology behind PIP(tm) 2A9, Query Electronic Component Technical Information.

"Valor believes that a standard for component description is badly needed," said Moshik Kovarsky, CTO, Valor. "EC PinPak provides an excellent way for component manufacturers and information providers to deliver accurate data for DFM as well as for shop floor equipment. Valor looks forward to the adoption of the standard."

"Our participation in the EC PinPak standard is an element of Mentor's initiative to effectively integrate the design process into the global supply chain," said Henry Potts, V.P. and G.M. of Mentor Graphics' System Design Division. "The EC PinPak specification is a step in that direction and will allow Mentor's customers to effectively use Web-based supply chain content to shorten critical cycle times."

At DAC, Si2 demonstrations illustrated the significant time-to-designer benefits achievable with the PIP(tm) 2A9 and EC PinPak standards by integrating Internet-based searching for components based on component class using PIP(tm) 2A9 technology, viewing datasheets and EC PinPak Library data, selection of candidate components of interest to designers and interactions with EDA applications based on real-time download of EC PinPak data.

"The EC PinPak project demonstrates how standards generate results that are beneficial to the industry as a whole," said Andrew Graham, president, Si2. "Si2 members are championing projects, such as EC PinPak, which are helping to increase productivity and reduce costs for the industry."

Now, companies using RosettaNet PIP(tm) 2A9 can query for and have delivered over the Internet, EC PinPak-compliant information where it is available. The companies participating in the EC PinPak project anticipate rapid and widespread adoption of this specification over the next year.

About ECIX

Electronic Component Information eXchange (ECIX) enables a seamless, real-time, Internet-based worldwide flow of usable information for everything on, in and about standard components and System-on-Chip (SoC) virtual components, by enabling designers to request component information on demand from suppliers worldwide. This information is machine and human sensible, and it is platform, tool and vendor independent. In partnership with RosettaNet, these specifications have become a platform for significant e-Business interface processes within the electronic component supply chain. For more information on ECIX, visit www.si2.org/ecix.

About Si2

Silicon Integration Initiative Inc. (Si2) provides engineering consultation and services to industry-leading silicon, electronic systems and EDA companies for synergistic, multi-company efforts focused on improving productivity and costs in the design and production of integrated silicon systems. The organization represents members throughout North America, Europe and Asia. For more information about Si2, visit www.si2.org.