DongbuAnam Targets Camera Phone Designs With High-Volume Production Of Megapixel-Grade Wafers For CMOS Image Sensors.Business Editors/High-Tech Writers SANTA CLARA Santa Clara, city, Cuba Santa Clara (sän`tä klä`rä), city (1994 est. pop. 217,000), capital of Villa Clara prov., central Cuba. , Calif.--(BUSINESS WIRE)--Nov. 3, 2003 Advanced 2.5V CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. Process Delivers SXGA (Super XGA) A screen resolution of 1280x1024 pixels. SXGA is commonly used on standard monitors, but provides a 1.25:1 aspect ratio, compared to the more common 1.33:1 (4:3) ratio. SXGA+ has a 1400x1050 resolution, which is an exact 1.33:1 ratio. See PC display modes. Resolution for Digital Imaging Applications DongbuAnam Semiconductor, the world's fourth largest pure-play wafer foundry, today announced it has begun volume production of megapixel-grade CMOS Image Sensor A CMOS-based chip that records the intensities of light as variable charges similar to a CCD chip. Although initially used in less expensive digital cameras, the quality of CMOS sensors has improved steadily. CMOS sensors have advantages over CCDs. (CIS Cis (sĭs), same as Kish (1.) (1) (CompuServe Information Service) See CompuServe. (2) (Card Information S ) chips that meet the SXGA (1280x1024) standard for high resolution. The highly integrated CIS chips, which feature optimized color filter Color filter An optical element that partially absorbs incident radiation, often called an absorption filter. The absorption is selective with respect to wavelength, or color, limiting the colors that are transmitted by limiting those that are absorbed. , micro-lens and photodiode A light sensor (photodetector) that allows current to flow in one direction from one side to the other when it absorbs photons (light). The more light, the more the current. Used to detect light pulses in optical fibers and other light-sensitive applications, it works the opposite of a structures, are ideally suited for camera phone designs as well as other compact digital imaging applications. According to Dr. Wesley Min, senior EVP EVP Executive Vice President EVP EGR (Exhaust Gas Recirculation) Valve Position Sensor EVP Electronic Voice Phenomenon EVP Europäische Volkspartei (Germany) EVP Employee Value Proposition , worldwide marketing, DongbuAnam's SXGA-enabling process technology integrates Red/Blue/Green color filters, micro-lens and photodiodes on a single chip using 0.25-micron design rules. "We believe the advanced features of our 2.5V mixed-signal CMOS process, together with the total manufacturing support we provide through our GeneCIS(TM) program, makes DongbuAnam the clear foundry choice for CIS production," said Dr. Min. In-Stat/MDR forecasts overall unit shipments of image sensors to double over the next five years, reaching approximately 500 million units in 2007. As CIS devices continue to displace sensors made with CCD CCD in full charge-coupled device Semiconductor device in which the individual semiconductor components are connected so that the electrical charge at the output of one device provides the input to the next device. (charge coupled device) technology, unit shipments of each type are expected to be nearly even by 2007, according to the high-tech market research firm. Comparing CIS and CCD technologies, Dr. Min said, "Our fine-tuned photodiode, color filter, and micro-lens structures combined with our use of high-quality PIP capacitor and an optimized silicide sil·i·cide n. A compound of silicon with another element or radical. Noun 1. silicide - any of various compounds of silicon with a more electropositive element or radical process that minimizes leakage current, enables us to deliver an SXGA performance that is very competitive compared to CCD image sensors using similar design rules." Among DongbuAnam's initial customers for megapixel-grade wafers is a fabless firm located within South Korea's dynamic semiconductor manufacturing infrastructure. This firm uses proprietary signal-processing algorithms and design techniques to differentiate the CIS solutions it offers to the manufacturers of camera phones. "We expect CIS devices to eclipse CCDs in high-volume digital imaging applications because they consume less power, and can be integrated with other functions on a single chip," added Dr. Min. "Moreover, we aim to accelerate the use of CIS over CCD by making it much easier for fabless, IDM (1) See identity management. (2) (Integrated Device Manufacturer) A company that performs every step of the chip-making process, including design, manufacture, test and packaging. Examples of IDMs are Intel, AMD, Motorola, IBM, TI and Lucent. and system companies to develop and manufacture their CIS chips through our GeneCIS program." Dr. Min noted that DongbuAnam expects to complement its current volume production of 0.25-micron megapixel wafers with volume production of 0.18-micron wafers before year end. About DongbuAnam's GeneCIS Program Using the full suite of GeneCIS services, DongbuAnam customers can eliminate virtually all of the hassle of coordinating manufacturing logistics associated with CIS devices. Providing a reliable single-point contact, DongbuAnam complements its foundry services with a well-coordinated range of design, manufacturing, assembly and testing services to accelerate time-to-market. The comprehensive support that DongbuAnam provides through its GeneCIS program includes: -- Process Designer's Kit (PDK PDK Phi Delta Kappa (professional organization for teachers) PDK Portal Development Kit (SAP Enterprise Portal) PDK Peachtree-Dekalb Airport (Atlanta, GA, USA) ) that details process specifications, design libraries, SPICE models and layout guidelines -- Silicon foundry and optical layer post-processes from a single Class 1 wafer facility -- Customized optical layer post-processes to achieve best overall sensor performance -- Specialty optical packaging, assembly and electro-optical testing through local strategic partners About DongbuAnam Semiconductor DongbuAnam Semiconductor, the world's fourth largest pure-play wafer foundry, specializes in world-class CMOS wafer processing that enables system-on-a-chip implementations that integrate the most advanced logic, analog, and mixed-signal technologies. Through close working relationships with strategic partners, DongbuAnam offers a broad range of services that augment its world-class wafer manufacturing capabilities. These include advanced design support, access to wide variety of intellectual property, and prototyping, as well as backend assembly, packaging and testing. DongbuAnam is a key global supplier within Korea's well-established semiconductor manufacturing infrastructure. For more information, visit www.dsemi.com. |
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