DongbuAnam Completes 0.13-micron CMOS Process Development; Top-Tier Foundry Paves the Way to Achieve Volume Production In Q1-2004.

Business Editors/High-Tech Writers

2003 FSA Suppliers Expo

SAN JOSE, Calif.--(BUSINESS WIRE)--Oct. 9, 2003

DongbuAnam Semiconductor, the world's fourth largest pure-play wafer foundry, today announced that it has completed all critical development stages for its 0.13-micron CMOS process, paving the way to begin production for its lead customer in the first quarter of 2004. With the release of the 0.13-micron process, DongbuAnam joins the ranks of a select few foundries with a stable and well-developed 0.13-micron technology with all copper metal interconnects. As a result, fabless, IDM, and systems companies now have a choice in selecting a 0.13-micron foundry partner.

To facilitate the development of deep sub-micron process technologies, DongbuAnam assembled top-notch engineers to form an internal Nano Project Team, assigned with the initial task to develop the 0.13-micron process. Working closely with Toshiba, DongbuAnam's longstanding technology partner, the Nano Project Team was able to benefit immensely from their 0.13-micron process development experiences. Leveraging this technology partnership, the Nano Project Team was able to accelerate the 0.13-micron technology development while avoiding all the problems and pitfalls that other foundries have encountered during the development of this technology.

"The Nano Project Team achieved first silicon success with product yields on target with our lead customer's expectations, after navigating smoothly through all of the critical development stages," said Dr. Wesley Min, senior EVP, worldwide marketing for DongbuAnam. "Our scheduled ramp to volume production with this 0.13-micron technology in early 2004 is well timed to support the semiconductor market recovery in general and the demand for 0.13-micron SoC designs for wireless, networking and consumer electronics products in particular," added Dr. Min.

"The demand for 0.13-micron chips is just beginning to build so DongbuAnam is in the right place at the right time," said Joanne Itow, senior analyst with Semico Research. "It's not easy to predict market demand especially now, but as the recovery continues, we see a pent-up demand for chips in the sub-micron process geometries."

Upon the release for production of the 0.13-micron process early next year, DongbuAnam will immediately follow with a foundry-compatible process. The foundry-compatible 0.13-micron process (GL130S) matches physical and electrical design rules to that of other foundries. This foundry-compatible technology allows fabless companies to target their existing and new designs to DongbuAnam with minimum risk and resources while achieving high-volume production very quickly.

The 0.13-micron process will feature up to eight layers of copper metal interconnects. The process also provides a poly transistor gate length as small as 0.08-microns, with plans underway to support high-performance (LV130S), and low-power (LP130S) processes. With a 1.2V core and I/Os of 2.5V and 3.3V, plus a 6-T SRAM cell measuring only 2.43 square microns, DongbuAnam's 0.13-micron process supports SoC designs that integrate high-density SRAM as well as the implementation of logic, mixed-signal and embedded memory functions. Early adopters may now access DongbuAnam's complete 0.13-micron baseline, which includes a fully developed process design kit, supported by industry standard cell libraries and EDA tool flows.

About DongbuAnam Semiconductor

DongbuAnam Semiconductor, the world's fourth largest pure-play wafer foundry, specializes in world-class CMOS wafer processing that enables system-on-a-chip implementations that integrate the most advanced logic, analog, and mixed-signal technologies. Through close working relationships with strategic partners, DongbuAnam offers a broad range of services that augment its world-class wafer manufacturing capabilities. These include advanced design support, access to wide variety of intellectual property, and prototyping, as well as backend assembly, packaging and testing. DongbuAnam is a key global supplier within Korea's well-established semiconductor manufacturing infrastructure. For more information, visit www.dsemi.com.