Dongbu HiTek Drives Wafer Quality Management Breakthrough.Industry's First Integration of Key Quality Management Tools Dramatically Shrinks Fault Detection/Analysis Time While Boosting Wafer Yields and Process Stability SEOUL, South Korea -- Dongbu HiTek today announced the semiconductor industry's first successful integration of key quality management tools to improve and expedite wafer quality management. By integrating Yield Management System (YMS YMS Yardley-Makefield Soccer (Pennsylvania) YMS Yard Management System (system for managing container terminal yards) YMS Yield Management System YMS Young Men's Survey ) and Fault Detection & Classification (FDC FDC - Floppy Disk Controller ) tools, the Korean company has developed DETDAS (Dongbu Early Trouble Detection and Analysis System), which reduces fault detection and analysis from 2-to-3 days to less than one hour while sharply increasing wafer yields and process stability. Prior to Dongbu HiTek's DETDAS breakthrough, YMS and FDC tools were utilized separately to resolve certain yield-loss factors. While YMS performed as an off-line tool to determine sources of yield loss, FDC independently monitored fab equipment parameters in real time. Demonstrating Dongbu HiTek's commitment to Six Sigma Not to be confused with Sigma 6. Six Sigma is a set of practices originally developed by Motorola to systematically improve processes by eliminating defects.[1] A defect is defined as nonconformity of a product or service to its specifications. quality management, the innovative DETDAS development presents a unified view of product yield and manufacturing data. Moreover, the real-time interaction and correlation between YMS and FDC metrics enable rapid defect analysis (programming) defect analysis - Using defects as data for continuous quality improvement. Defect analysis generally seeks to classify defects into categories and identify possible causes in order to direct process improvement efforts. and resolution, thereby lowering manufacturing costs and maximizing the yields of the increasingly complex chip designs coming to market. According to Dongbu HiTek, the DETDAS development was completed in record time to meet customer demand to accelerate time to market with high quality wafers in a stable manner. The company noted that a taskforce consisting of some 60 technology personnel worked on the YMS/FDC tool integration over a seven month period, and that investment in new software and hardware totaled about US$6 million. About Dongbu HiTek Headquartered in Seoul, Korea, Dongbu HiTek Co., Ltd. offers advanced products and services across three major business areas: Agriculture, Materials and Semiconductor. The Semiconductor Business provides specialized proprietary chips and modules as well as foundry services that add high value to display, mobile and various analog applications. The company's two world-class fabs currently process 200mm wafers at nodes ranging from 0.35 microns to 110 nanometers. This wafer processing is supported by comprehensive design support (IP and design libraries), prototype development /verification, and packaging/module development. The Semiconductor Business specializes in developing best-in-class CMOS Image Sensor A CMOS-based chip that records the intensities of light as variable charges similar to a CCD chip. Although initially used in less expensive digital cameras, the quality of CMOS sensors has improved steadily. CMOS sensors have advantages over CCDs. (CIS Cis (sĭs), same as Kish (1.) (1) (CompuServe Information Service) See CompuServe. (2) (Card Information S ) and Display Driver IC (DDI ddI and ddC: see AZT. ) chips as well as chips that incorporate either High Voltage or Flash memory functions. Dongbu HiTek's stock is publicly traded under 000990 on the Korea Stock Exchange Korea Stock Exchange The major securities market of Korea. . For more information, visit www.dongbuhitek.com. |
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