Dongbu Electronics and Silicon File Technologies Jointly Develop New Process to Implement 5 Megapixel CMOS Image Sensor Devices.Volume Production of CIS Cis (sĭs), same as Kish (1.) (1) (CompuServe Information Service) See CompuServe. (2) (Card Information S Chips at 130nm Node Using Cost-Efficient 3-Layer Aluminum Interconnect Structure to Begin Early Next Year SEOUL, South Korea -- Dongbu Electronics, Korea's largest pure-play foundry, today announced that it has collaborated with Silicon File Technologies, a Korean fabless company Fabless Company The Fabless Semiconductor Association (FSA) defines fabless as follows: Fabless (without fab) refers to the business methodology of outsourcing the manufacturing of silicon wafers, which hundreds of semiconductor companies have adopted. specializing in CMOS Image Sensor A CMOS-based chip that records the intensities of light as variable charges similar to a CCD chip. Although initially used in less expensive digital cameras, the quality of CMOS sensors has improved steadily. CMOS sensors have advantages over CCDs. (CIS) design, to develop a new process that can implement 5 Megapixel CIS devices at the 130nm node. Volume production of CIS devices using the new process is expected to begin during the first quarter of 2007. Instead of using 7-to-8 layers of copper wiring commonly used in processing wafers at the 130nm node, the new process deploys a 3-layer aluminum interconnect structure. As a result, the CIS devices implemented with the new process are expected to cost less to produce without compromising performance. Moreover, Silicon File's shift from a 0.18-micron to a 130nm process is expected to result in further cost savings as more than 30 percent more CIS chips can be produced per wafer. According to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. Dr. Jae Song, EVP EVP Executive Vice President EVP EGR (Exhaust Gas Recirculation) Valve Position Sensor EVP Electronic Voice Phenomenon EVP Europäische Volkspartei (Germany) EVP Employee Value Proposition of Dongbu Electronics, the new 5-Megapixel CIS process announced today was preceded by his company's successful development of a 2-Megapixel CIS process at the same 130nm node. He confirmed that his company continues to aggressively expand its portfolio of intellectual property and design libraries, both through internal development and third parties, to make its CIS wafer processing technologies "second to none." New CIS Process Benefits Dongbu Electronics reports that the new CIS process announced today delivers more than a finer 130nm line width and cost-efficient 3-layer aluminum interconnect structure. Among other attributes, the new process specifies the following: * Distance between the photodiode A light sensor (photodetector) that allows current to flow in one direction from one side to the other when it absorbs photons (light). The more light, the more the current. Used to detect light pulses in optical fibers and other light-sensitive applications, it works the opposite of a and the micro lens, which is situated in the uppermost layer and through which light filters, has been reduced to less than 4 microns, making it the shortest distance in the industry. This compares to a 5-micron distance in CIS chips from the world's largest CIS device manufacturer, Micron Technology Micron Technology ("Micron") NYSE: MU is a multinational company based in Boise, Idaho, USA, best known for producing many forms of semiconductor devices. This includes DRAM, SDRAM, flash memory, and CMOS image sensing chips. Inc. * Color quality is dramatically improved in terms of resolution, gray scale, relative illumination and color crosstalk among red-green-blue pixels, thereby improving sensitivity by more than 20 Percent. Moreover, an additional compatible process can be utilized to reduce leakage current to substantially offset dark current, perhaps the biggest obstacle in improving CIS chip image quality. This process enhances low light performance, thus putting CIS chip image quality on a par with the best CCD CCD in full charge-coupled device Semiconductor device in which the individual semiconductor components are connected so that the electrical charge at the output of one device provides the input to the next device. solutions. "We have clearly positioned Dongbu Electronics as a technology leader in specialized CIS processing that enables the implementation of high resolution CIS devices at very competitive price points," said Dr. Song. He noted that Dongbu is targeting early 2008 to qualify a CIS process at the 110nm node for volume production. Demand for 2-Megapixel CIS devices is forecast to more than double from about 130 million units in 2006 to about 350 million units in 2007, while demand for CIS devices specifying 4 Megapixels or more are expected to command more than half of the entire market in 2009. CMOS Image Sensor Market Outlook graphics are available upon request. About Dongbu Electronics Dongbu Electronics provides world-class CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. processing for system-on-chip solutions that integrate advanced logic, analog, and mixed-signal technologies. As a "Specialty Solution Partner" in high-growth markets, such as those represented by mobile handsets and flat-panel displays, Dongbu adds high value with specialized processing for CMOS Image Sensor (CIS), High Voltage, Embedded Flash, and LCD Driver IC (LDI See OpenLDI. ) functions. Dongbu's collaborate-and-thrive approach is evident across the entire manufacturing spectrum including prototype development/verification, packaging/module development, complete turnkey solutions, and accelerating time to volume production. The company's stock is publicly traded under 001830 on the Korea Stock Exchange Korea Stock Exchange The major securities market of Korea. . For more information, visit www.dongbuelec.com. |
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