DesignCon 2006 Exhibitor Profiles.

SANTA CLARA, Calif. -- DesignCon 2006 takes place 06 - 09 Feb. at the Santa Clara Convention Center. For in-depth information about the event visit http://www.designcon.com/2006/.

Below are profiles from DesignCon 2006 exhibitors; breaking news releases are available at http://www.tradeshownews.com, Business Wire's trade show, conference, and event news resource.

Business Wire is the official news wire service for DesignCon 2006.

Company: CAD DESIGN SOFTWARE
Booth/Stand: 809
Media Contact: Gordon Jensen
Phone: [phone]
E-mail: [e-mail]
Web: www.cad-design.com

If you're not using real 3D layout software when designing IC
packages, you're wasting your time and your company's money. CAD
Design Software's true 3D IC Package Design tools integrate 3D
Bondwire Optimization and 3D DRC into your high performance SiP layout
process (Stacked Die, Stacked Packages, uBGA(TM), Flip-Chip, Advanced
Hybrid/MCM, CSP, etc.). With the most advanced set of custom DRC rules
available, and multiple data outputs, you will dramatically reduce
overall design time and improve manufacturing yield, saving you time,
and your company money. Just released: Version 7.4CAD Design Software.
Helping you work smarter, not harder.

Company: Cadence Design Systems, Inc.
Booth/Stand: 427
Ticker Symbol & Exchange: NASDAQ:CDNS
Media Contact: Bruce Chan
Investor Relations Contact: Jennifer Jordan
Phone: [phone]
Web: www.cadence.com

Cadence enables global electronic-design innovation and plays an
essential role in the creation of today's integrated circuits and
electronics. Customers use Cadence software and hardware,
methodologies, and services to design and verify advanced
semiconductors, printed circuit boards and systems used in consumer
electronics, networking and telecommunications equipment, and computer
systems. Cadence reported 2004 revenues of approximately $1.2 billion,
and has approximately 5,000 employees. The company is headquartered in
San Jose, Calif., with sales offices, design centers, and research
facilities around the world to serve the global electronics industry.
More information is available at www.cadence.com.

Company: Carbon Design Systems
Media Contact: Georgia Marszalek
Phone: [phone]
E-mail: [e-mail]
Web: www.carbondesignsystems.com

Carbon delivers a high-performance virtual system prototyping
solution, VSP, that enables a system prototype to be rapidly assembled
and functionally validated on the desktop months before silicon.
Carbon's new software approach allows multiple levels of abstraction
to be validated together including C, SystemC, Verilog and VHDL RTL,
IP cores, transaction-level, and instruction-level models. The key to
VSP is silicon accuracy and performance; the ability to execute
billions of cycles and boot embedded operating systems, all with
desktop software. The company is headquartered at 375 Totten Pond
Road, Suite 100/200, Waltham, MA. 02451. Telephone: [phone],
Fax: [phone], Email: [e-mail]

Company: CAST, Inc.
Booth/Stand: 913
Media Contact: Paul Lindemann
Phone: [phone]
E-mail: [e-mail]
Web: www.cast-inc.com

CAST offers 100 different IP cores, from basic processors and standard
interfaces to the latest applications. At DesignCon we're announcing a
new, highly configurable 8051 core that allows designers to tailor
this venerable embedded processor to their specific technology or
application requirements. We're also featuring live demos of cores for
two very-fast growing technologies: our PCI Express Endpoint
Controller and H.264 Video Encoder. In addition, our newest partners
SoC Solutions will be on hand to help demo our step up from individual
cores, Pre-integrated IP (PiP) platforms combining multiple cores and
essential software for rapidly developing ARM(R)-based systems.

Company: Centellax
Booth/Stand: 126
Media Contact: Raj Savara
Phone: [phone]
E-mail: [e-mail]
Web: www.centellax.com

Centellax delivers low-cost, high-performance test instruments, test
accessories, and electronic components for high-speed communication
and signal integrity applications. Centellax key products include a
10G BERT, both 10G and 40G PRBS generators, and ultra-broadband
amplifier modules. The TG1B1A 10G BERT is small size, yet a high
performance box targeted at manufacturing test for automated Bit Error
Rate Testing on PCB, Optical components, andelectrical connectors.
Centellax Inc. 451 Aviation Blvd. Suite 101 Santa Rosa, CA
95403-1069 ph707 568-5900  fx707 568-7647 www.centellax.com

Company: Giga Scale IC
Media Contact: Georgia Marszalek
Phone: [phone]
E-mail: [e-mail]
Web: www.gigaic.com

Founded in 2003 in Cupertino, Calif., Giga Scale IC develops and
markets InCyte, a chip estimation tool which dramatically reduces the
risk, design time, and cost of IC design. It accurately estimates key
IC specifications, including size, power, leakage, yield, and cost.
InCyte users enter a specification through the tool's intuitive
interface and, within seconds, InCyte generates an estimated floorplan
and a complete datasheet. InCyte's chip estimates are accurate to
within ninety-five percent of final silicon. Since the February 2005
launch of www.ChipEstimate.com, the Web distribution portal for
InCyte, the user community has grown to more than 4,000 members, who
have estimated more than 20,000 chip designs.

Company: iRoC Technologies
Booth/Stand: 715
Media Contact: Olivier Lauzeral
Investor Relations Contact: Eric Dupont
Phone: [phone]
E-mail: [e-mail]
Web: www.iroctech.com

iRoC Technologies Corporation is one of the world's leading commercial
providers of soft error solutions for integrated circuits (ICs). iRoC
provides soft error testing (SERTEST(TM)), optimization tools
(TFIT(TM), SoCFIT(TM)), and protection services (SERPRO(TM)) that help
semiconductor companies estimate the reliability risks of soft errors
and eliminate them during the chip design process. Caused by
atmospheric radiation and packaging impurities, soft errors have
historically been a major concern for aerospace and aviation markets,
and are now also the fastest growing reliability problem for
semiconductors.

Company: Magma Design Automation
Booth/Stand: 618
Ticker Symbol & Exchange: LAVA - NASDAQ
Media Contact: Monica Marmie, Dir Marcom 408-565-7689
Investor Relations Contact: Milan Lazich, VP Corp Mrktg
408-565-7706
Phone: [phone]
E-mail: [e-mail]
Web: www.magma-da.com

Magma's software for integrated circuit (IC) design is recognized as
embodying the best in semiconductor technology. The world's top chip
companies use Magma's EDA software to design and verify complex,
high-performance ICs for communications, computing, consumer
electronics and networking applications, while at the same time
reducing design time and costs. Magma provides software for IC
implementation, analysis, physical verification, characterization and
programmable logic design, and the company's integrated RTL-to-GDSII
design flow offers "The Fastest Path from RTL to Silicon"TM. Magma is
headquartered in Santa Clara, Calif. with offices around the world.
Magma's stock trades on Nasdaq under the ticker symbol LAVA. Visit
Magma Design Automation on the Web at www.magma-da.com.

Company: MEPTEC
Booth/Stand: 843
Media Contact: Bette Cooper
Phone: [phone]
E-mail: [e-mail]
Web: www.meptec.org

MEPTEC (Microelectronics Packaging and Test Engineering Council) is a
trade association of over 600 semiconductor suppliers, manufacturers
and individuals committed to enhancing the competitiveness of the
back-end portion of the semiconductor business. MEPTEC is concerned
exclusively with assembly, packaging and test issues and is dedicated
to the advancement of that segment of the industry. For more
information visit www.meptec.org.

Company: MERITEC / Joy Signal Technology
Booth/Stand: 820
Media Contact: Ken Braund, Sales & Marketing Manager
Investor Relations Contact: Howard Venaleck, Chief Financial Officer
Phone: [phone]
E-mail: [e-mail]
Web: WWW.MERITEC.COM

Meritec and its affiliate, Joy Signal Technology, are vertically
integrated manufacturers of high-performance connectors, cable
assemblies, and complete interconnect systems serving the global
electronics market. Four decades of experience in supplying engineered
interconnect solutions to Communications, Medical, Instrumentation
(ATE), Computer, Gaming, Commercial, Industrial and Military/Aerospace
market segments. At DesignCon Booth 820, Meritec will be featuring its
robust 4X and 12X Cabling and PCI Express Right Angle Connectors.
Meritec also offers a complete line of 2mm HM Cabling, cPCI Cabling,
Right Angle PCI Connectors, Sockets, Angled DIMM Sockets, Flat Flex
Cabling. - From Concept to Connection - Meritec provides Design
through Manufacture in the USA - WWW.MERITEC.COM - 888-MERITEC
(888-637-4832).

Company: Nova Semiconductors
Booth/Stand: 806
Media Contact: Fuad Abu Nofal
Phone: [phone]
E-mail: [e-mail]
Web: www.novasemi.com/eda.html

Nova will exhibit Chipmason at DesignCon/2006. "Chipmason" is a rapid
silicon prototyping and floorplanning EDA toolset that supports
package/chip co-design, hierarchical design flow and layout re-use
methodology. Chipmason enables users to partition large designs,
create accurate layout and timing abstracts/budgets. They can go from
logic design view to a detailed floorplan with IO pads, power grid,
block placement and pin assignment allowing them to quickly find and
fix routing congestions as well as critical timing paths. Users save
significant engineering cost when using Chipmason to create re-usable
layout blocks, in the same chip or different chips. See details at:
http://www.novasemi.com/eda.html

Company: Optimal Corporation
Booth/Stand: 613
Media Contact: Kristine Perham
Investor Relations Contact: Dave DeMaria
Phone: [phone]
E-mail: [e-mail]
Web: www.optimalcorp.com

Optimal Corporation is the leading provider of high-performance EDA
tools, serving the IC, Packaging and PCB design markets. Our
state-of-the-art technology enables advanced designers to rapidly
analyze the signal integrity, power delivery, high-frequency and
thermal/mechanical characteristics of their IC, Package and PCB
designs. We are vital to our customers because we consistently deliver
innovative, best-in-class solutions with the lowest cost of ownership.
From our flagship PakSi-E and PakSi-TM to our best-in-class O-Wave and
PowerGrid, Optimal has the technology to deliver unparalleled analysis
capability and fast design turn-around for advanced designers and
engineering groups. Our customers include top-tier IC design houses,
package houses, global IC foundries, systems designers and advanced
board designers.

Company: Samtec
Booth/Stand: 325
Media Contact: Pam Grieb
Phone: [phone]
E-mail: [e-mail]
Web: www.samtec.com

Samtec manufactures Board-to-Board, Cable-to-Board, Panel-to-Board,
and Panel-to-Panel interfaces. Worldwide revenue in 2005 was over
$265 million. Samtec is an ISO 9001:2000, ISO 14001 and TS 16949
certified company. Samtec provides "Sudden Service" with High Speed,
High Density, Micro, Rugged, Power, RF, and I/O connectors and cable
assemblies, one to three day lead times, samples shipped via Air
within 24 hours of request, our Signal Integrity Group, and our Sudden
Information web site. Samtec has 17 locations worldwide to serve you.

Company: Silicon Integration Initiative (Si2)
Booth/Stand: 936
Media Contact: Bill Bayer
Phone: [phone]
E-mail: [e-mail]
Web: www.si2.org

Si2 is a not-for-profit organization of industry-leading
semiconductor, systems and EDA tool companies focused on improving
productivity and reducing cost in creating and producing integrated
silicon systems. We believe that through collaborative efforts, the
industry can achieve higher levels of systems-on-silicon integration
while reducing the cost and complexity of integrating future design
systems. Si2 is uniquely positioned to enable collaboration through a
strong implementation focus driven by its member companies. Si2 was
founded in 1988 and today represents 95+ semiconductor and equipment
manufacturers, electronic systems companies, and EDA tool suppliers
all over the world.

Company: Vitesse
Booth/Stand: 1002
Ticker Symbol & Exchange: VTSS
Media Contact: Juan Garza
Investor Relations Contact: Yatin Mody
Phone: [phone]
E-mail: [e-mail]
Web: www.vitesse.com

Vitesse designs, develops, and markets a diverse portfolio of
high-performance, cost-competitive semiconductor solutions for
communications and storage networks worldwide. Engineering excellence
and dedicated customer service distinguish Vitesse as an industry
leader in Gigabit Ethernet LAN, Ethernet-over-SONET, Advanced
Switching, Fibre Channel, Serial Attached SCSI, Optical Transport, and
other applications. Vitesse innovation empowers customers to deliver
superior products for Enterprise, Access, Metro, and Core
applications. Additional company and product information is available
at www.vitesse.com.

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