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Articles 1-15 out of 15 article(s) Title Author Type Date Words CNT's Effective Role in Designing Field-Effect Transistors Revealed. Oct 18, 2009 259 Beamed up: QPC Lasers Inc. has received its third new patent this year, and its ninth overall related to design and manufacture of semiconductor lasers. Yung, Jean Brief article Apr 21, 2008 56 DARPA looks for ways to verify integrated computer chip security. Magnuson, Stew Oct 1, 2007 363 Designing with decoupling capacitors: mount the decoupling capacitor on the side of the board with the smallest rectangular loop area to net the lowest inductance. Archambeault, Bruce Apr 1, 2007 1045 AMI Semiconductor Takes Active Role in Key Analogue and RF Workshop. Dec 18, 2006 356 Oxford Semiconductor Controller Adds High-Speed USB Peripheral Connectivity to Storage Hungry Portables. Dec 14, 2006 465 AMI Semiconductor Continues to Lead the Industry in FPGA-to-ASIC Conversions. Nov 13, 2006 521 ID Smart Successfully Designs New Smart Card Using State-of-the-Art Semiconductors. Nov 6, 2006 274 Fairchild Semiconductor's AEC-Q101 Low-Voltage 30/40V MOSFETs Offer Performance, Efficiency and Space Benefits in Automotive Designs. Sep 13, 2006 700 Jazz Semiconductor and Mentor Graphics Release Comprehensive Design Kits for Analog/Mixed-Signal Integrated Circuit Design Flow. Company overview Sep 5, 2006 1117 Mixing plastic and silicon yields form-fitting circuitry. (Electronics in the Round). Weiss, P. Brief Article Aug 31, 2002 437 CCGA design variables and their effects on reliability: using full array, thin ceramic substrates and lidless packages can improve the thermal cycle fatigue life of CCGAs. Milkovich, Cynthia Jan 1, 2002 3265 Automated Photonic Assembly -- A fertile field full of holes and rocks. Murray, Jerry Oct 1, 2001 1478 Adding Jumper Wires Through "Gopher Holes" -- Few options exist in BGA modification, but, if the need arises, here's one option to try. Ferry, Jeff Brief Article Oct 1, 2001 517 Die Bonding in an Optoelectronic World -- PCB assemblers venturing into optoelectronics will encounter new substrates and package designs that call for uncommon bonding equipment capabilities. Moore, Don Oct 1, 2001 1971