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1-38 out of 38 article(s)
Title Author Type Date Words
Managing crosstalk and ground bounce: designing for higher speeds and operating frequencies demands close scrutiny to minimize the effects of unwanted energy transfer and noise in the system. Ali, Syed W. Jul 1, 2009 1585
IC package to PCB co-design: advances in IC packages provide designers with pin assignment control that reduces routing time, improves signal integrity and reduces layer count. Jordan, Benjamin Mar 1, 2009 1924
Solve design problems with signal integrity optimization: optimization routines save time by using automated methods to determine if performance goals are met. Zabinski, Pat; Buhrow, Ben; Gilbert, Barry; Daniel, Erik Apr 1, 2008 2084
Benefits of implementing differential pairs: when using differential circuits, specific, design rules can maximize the advantages while minimizing design-induced difficulties. Ali, Syed W. Dec 1, 2007 1516
Sierra Proto Express and CadParts & Consulting formed a strategic alliance to sell a complete PCB design. May 1, 2007 24
The impact of lead-free processing on interconnect reliability: lead-free assembly requires a balance between copper, base material and design to assure reliability. Reid, Paul Cover story Mar 1, 2007 1835
Selecting the right SerDes device: OEM designers and their EMS partners should evaluate SerDes device characteristics and match them to know PCB design constraints to improve overall performance. Ali, Syed W. Mar 1, 2007 1612
Embedded passive test programs: ECIT active with OEMs on embedded passive testing. Snogren, Richard Company overview Nov 1, 2006 1095
3D thermal modeling: concurrent engineering tackles the thermal challenges of high-speed design. Ikemoto, Sherman Nov 1, 2006 1861
PCB design survey finds conflict between thermal, SI/EMC. Heffner, Tracy Oct 1, 2006 326
Manufacturing considerations of embedded passives; designing and building PCBs with EPs means knowing the tolerances of the different material sets. Snogren, Richard Nov 1, 2003 1054
Fabrication guidelines for backdrilling: for higher designs and thick boards backdrilling--the removal of plating from the unused portion of the via--reduces via capacitance and mitigates resonance. Cohen, Tom Nov 1, 2003 1462
Buried treasure. Buetow, Mike Nov 1, 2003 605
Predicting reliability of double-sided area array assemblies. Primavera, Anthony Oct 1, 2003 2188
Data format 'Offspring' sprung. Buetow, Mike Oct 1, 2003 465
Does your design need HDI? HDI is more expensive process, but overall product cost can be lower thanks to fewer layers and smaller boards. Holden, Happy Oct 1, 2003 1603
Decoupling strategies for PCBs: there's more to good decoupling than flooding your board with capacitors. The light caps and smart layout are essential. Thompson, Joe Oct 1, 2003 1845
PCB directions: don't lose your way. Use these guidelines and stay on course. Bogatin, Eric Oct 1, 2003 753
Via modeling for high-speed simulations, Part 2: a method for creating via models and integrating into a network topology for high-speed PCB simulations. Riazi, Abe Oct 1, 2003 995
Drivers and material sets: in the first of a regular column, we take a look at the embedded materials landscape. Snogren, Richard Column Oct 1, 2003 878
Preventing hole-wall pullaway: the first steps to take to ensure good electroless copper adhesion. Carano, Michael Oct 1, 2003 494
Via modeling for high-speed simulations, Part 1: a method for creating via models and integrating into a network topology for high-speed PCB simulations. Riazi, Abe Sep 1, 2003 1034
Rules of thumb I have known and loved: while no substitute for good design practices, in certain situations they can be useful. Bogatin, Eric Sep 1, 2003 766
Thermal analysis of base materials through assembly: can current analytical techniques predict and characterize differences in laminate performance prior to exposure to thermal excursions during assembly? Bergum, Erik J. Sep 1, 2003 2780
Routing differential pairs: while some argue that differential pairs work just fine if they are not coupled, the layout tradeoffs say that routing traces closely is prudent. (Differential Signaling). Nagle, Dennis Aug 1, 2003 1943
What causes reflections? In an ideal world signals would propagate down a line with no distortion. But this is no ideal world. (No Myths Allowed). Bogatin, Eric Aug 1, 2003 968
Conductive layer issues: why you must do more than just "view" your manufacturing data. (CAM Works). Miller, Jeff Aug 1, 2003 1045
Afraid of the dark? We'll examine the effect of severe black pad defect on solder bonds on BGAs. Downey, Marlin R. Jan 1, 2003 1919
A manufacturable lead-free surface-mount process? NEMI demonstrates that lead-free manufacturing may be possible using existing production tools and equipment. Bath, Jasbir Jan 1, 2003 2103
Spray fluxing--it's not the same old game: spray fluxing has advanced to become a versatile technique, capable of performing a variety of tasks. Berger, Harvey L. Jan 1, 2003 2569
When boards lose their edge: when the corner of a circuit board breaks or is damaged, the problem cannot be ignored. Ferry, Jeff Jan 1, 2003 696
Can you clean a no-clean assembly? Troubled assemblies are put to the test. Munson, Terry Jan 1, 2003 696
Orcad Unison PCB Design Suite. (Management News and Products). Brief Article May 1, 2002 173
Solder preforms in electronic packaging: selecting the correct solder preform helps assemblers avoid the difficult task of dispensing paste in through holes. Holtzer, Mitch Apr 1, 2002 1734
Die Bonding in an Optoelectronic World -- PCB assemblers venturing into optoelectronics will encounter new substrates and package designs that call for uncommon bonding equipment capabilities. Moore, Don Oct 1, 2001 1971
Automated Photonic Assembly -- A fertile field full of holes and rocks. Murray, Jerry Oct 1, 2001 1478
Adding Jumper Wires Through "Gopher Holes" -- Few options exist in BGA modification, but, if the need arises, here's one option to try. Ferry, Jeff Brief Article Oct 1, 2001 517
The True Cost of Lead Free -- Get the facts on lead free straight-less isn't always more. Zarrow, Phil Brief Article Jun 1, 2001 757

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