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Dataram FB-Dimms Placed on Supermicro(R) Recommended Memory Lists; 512MB & 1GB Capacities Tested and Approved.


PRINCETON, N.J. -- Dataram Corporation (NASDAQ NASDAQ
 in full National Association of Securities Dealers Automated Quotations

U.S. market for over-the-counter securities. Established in 1971 by the National Association of Securities Dealers (NASD), NASDAQ is an automated quotation system that reports on
: DRAM), a leading provider of server and workstation memory and a supplier to OEMs in medical, defense, telecom, HPC and IT industries, today announced two capacities of Fully Buffered Dual Inline Memory Modules (FBDimms) have been tested and approved by Supermicro. This new memory technology is designed for use in Supermicro's extensive server and workstation motherboard offerings that feature the Dual-Core Intel(R) Xeon(R) processor 5000 series "Dempsey" processors and 5000P "Blackford" and 5000X Greencreek chipsets with 8 or 16 memory slots. With server memory as the main product focus at Dataram, advanced engineering, manufacturing and testing capabilities are producing quality and compatible memory options available for quick delivery.

Each Supermicro Product Model has a recommended memory listing with the modules that have passed on the specific SKU. Dataram's DTM DTM

dermatophyte test medium.
65503A, 1GB and DTM65505A, 512MB Fully Buffered Dimms are PC4300, ECC (1) (Error-Correcting Code) A type of memory that corrects errors on the fly. See ECC memory.

(2) (Elliptic Curve Cryptography) A public key cryptography method that provides fast decryption and digital signature processing.
 240-pin and JEDEC-compliant are found on the lists. These DDR2-533 speed low-profile 30mm high modules feature Intel approved IDT V1.5 Advanced Memory Buffer (AMB) devices and a Full Body Heat Spreader spreader,
n See condenser.
 (FBHS FBHS Flowery Branch High School (Buford, GA)
FBHS Flour Bluff High School (Corpus Christi, TX)
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) with thermal interface material A Thermal Interface Material (aka TIM) is used to fill the gaps between thermal transfer surfaces, such as between microprocessors and heatsinks, in order to increase thermal transfer efficiency. These gaps are normally filled with air which is a very poor conductor.  (TIM) for improved thermal performance.

"Dataram is pleased to work with Supermicro on memory compatibility testing in support of an impressive roll out of 20+ Dempsey based serverboards," stated Paul Henke, Director Product Marketing at Dataram, "Supermicro is anticipating strong demand for these server solutions and Dataram is well positioned to deliver the memory options needed."

About Dataram

Founded in 1967, Dataram is a worldwide leader in the design and manufacture of reliable, high capacity and innovative memory solutions. Dataram provides customized memory solutions for OEMs and memory upgrades for leading brands including HP, IBM, SGI, Sun Microsystems, Dell, Intel, Supermicro and AMD (Advanced Micro Devices, Inc., Sunnyvale, CA, www.amd.com) A major manufacturer of semiconductor devices including x86-compatible CPUs, embedded processors, flash memories, programmable logic devices and networking chips.  Opteron. For more information about Dataram's memory offerings, visit www.dataram.com.

All names are trademarks or registered trademarks of their respective owners.
COPYRIGHT 2006 Business Wire
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Copyright 2006, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Business Wire
Geographic Code:1USA
Date:May 30, 2006
Words:310
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