DPAC Technologies Introduces Thin Profile Memory-Stack for `'Rack-Mount'' 1U Network Servers.Business Editors and High-Tech Writers GARDEN GROVE Garden Grove, city (1990 pop. 143,050), Orange co., S Calif., a suburb of Long Beach and Los Angeles, on the Santa Ana River; founded 1877, inc. 1956. Many of its residents work in nearby aerospace and defense installations, and there is light manufacturing. , Calif.--(BUSINESS WIRE)--Aug. 23, 2001 DPAC DPAC Denver Performing Arts Complex (CO, USA aka: DCPA) DPAC Deferred Policy Acquisition Costs (insurance) DPAC District Parent Advisory Committee DPAC Dover Partnership Against Crime Technologies Corp. (Nasdaq:DPAC) today announced that its thin profile Memory-Stack(TM) has successfully passed qualification at a leading memory module manufacturer and is currently in testing at a leading server OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and . The thin-profile memory stacks are used for a one gigabyte thin profile Registered DIMM (Dual In-Line Memory Module) A printed circuit board that holds memory chips and plugs into a DIMM socket on the motherboard. See memory module. DIMM - Dual In-Line Memory Module module for 1U servers. DPAC's new thin profile stack reduces the overall size of stacked memory components by more than 5 percent and uses the same manufacturing processes as its industry-leading LP-Stack(TM) product line, which keeps manufacturing lead times at a minimum. The market for service appliances is projected to grow from 62,000 units today to more than 700,000 by 2004, according to market researcher IDC. "The development of this technology is significant because it allows DPAC to provide our manufacturing partners with products that meet the industry's PC133 1.2-inch module standard," said John Sprint, COO of DPAC Technologies. "This technology is also applicable to our DDR (Double Data Rate) Refers to an SDRAM memory chip that increases performance by doubling the effective data rate of the frontside bus. For more details, see SDRAM. DDR - Double Data Rate Random Access Memory and FCRAM FCRAM Fast Cycle Random Access Memory FCRAM Fast Cycle Ram products, facilitating their use as demand grows for this application." "The addition of the thin profile Memory-Stack demonstrates our continuing commitment to providing the solutions demanded by the industry and our customers," commented Ted Bruce, president and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. . "Its introduction solves a memory density problem faced by many system manufacturers." DPAC has made this product available to its worldwide customers to meet their requirements for stacked memory components to be used on 1.2-inch DIMMS, and expects to have additional qualifications of this product in the next 90 days. About DPAC Technologies Based in Garden Grove, DPAC Technologies Advanced Packaging Group provides patented component packaging technology to create high-density, space-saving surface mount electronic components. DPAC's products are used in electronic circuits found in network servers, computer storage devices, medical instrumentation and communication devices. The company's System Design Group provides outsourced engineering design services to aid customers in creating cost-saving circuit designs. The Value Added Value Added The enhancement a company gives its product or service before offering the product to customers. Notes: This can either increase the products price or value. Manufacturing Group provides contract manufacturing of prototype designs and medium volume production runs of circuit boards. DPAC's mission is to provide products and services for the Integration Age. Investor information is available through their corporate headquarters investor relations Investor relations The process by which the corporation communicates with its investors. department at 714/898-0007 ext. 128, or contact Joe Zappulla at Wall Street Investor Relations at 301/907-4090. Visit the DPAC Web site at www.DPACtech.com. This news release includes forward-looking statements, including statements regarding the management's current beliefs concerning the company's market, technology development, expansion and business plans, relationships in price parity of existing technology with future technology, the need for emulation products, which are subject to change as a result of various risks or uncertainties. Every statement herein that is not historic in nature is a forward-looking statement. These factors would include, but are not limited to, challenges in integrating technologies or operations efficiently, protection of technology or proprietary rights, risks of litigation An action brought in court to enforce a particular right. The act or process of bringing a lawsuit in and of itself; a judicial contest; any dispute. When a person begins a civil lawsuit, the person enters into a process called litigation. , and others, and the uncertainty of successful qualification of its products by potential customers. The actual results may materially differ from those described in any forward-looking statement. Important factors that may cause actual results to differ are set forth in the company's periodic filing with the U.S. Securities and Exchange Commission including its Form 10-KSB for the year ended Feb. 28, 2001 or subsequent Forms 10-Q. |
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