DPAC Technologies Introduces Stackable Chip Scale Package for Next Generation DDR-333 Memory; Company Receives Patent for the Stacking of New High-Density Technology.Business Editors and High-Tech Writers GARDEN GROVE Garden Grove, city (1990 pop. 143,050), Orange co., S Calif., a suburb of Long Beach and Los Angeles, on the Santa Ana River; founded 1877, inc. 1956. Many of its residents work in nearby aerospace and defense installations, and there is light manufacturing. , Calif.--(BUSINESS WIRE)--Sept. 6, 2001 DPAC DPAC Denver Performing Arts Complex (CO, USA aka: DCPA) DPAC Deferred Policy Acquisition Costs (insurance) DPAC District Parent Advisory Committee DPAC Dover Partnership Against Crime Technologies Corp. (Nasdaq:DPAC), a provider of products and services for the Integration Age, today announced that it has successfully completed development of a new technology that allows mechanical stacking of chip-scale package memory devices utilizing a fine pitch ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (FBGA FBGA Fine-Pitch Ball Grid Array FBGA Fine Pitch Bga FBGA Fine Line Bga ) interface. Chip-scale packaging results in a significant reduction in the size of component packaging, and utilizes an interface consisting of tiny solder balls In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. on the bottom of the chip. Standard memory components currently being used and products scheduled for introduction in 2002, such as DDR-333 DRAM will use this advanced packaging. Traditional memory stacking methods will not work with this package style, and DPAC believes it is the first company to announce an electro-mechanical solution. "DPAC has invested several years of research into this breakthrough," said Ted Bruce, DPAC Technologies' president and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. . "DPAC has always had a commitment to be first to market innovative high-density memory products, and CS-Stack(TM) is our latest. "As early as 1998, DPAC began working to stack FBGA packages and, in the interim, we have submitted or are processing over a dozen patents for these technologies. Our latest award, U.S. Patent No. 6,262,895, is one of several of these in process." Kevin Perry, vice president of sales & marketing, noted that customers now have a competitive solution to consider as chip scale DRAM memory products begin to appear on the market for evaluation. "Up until now, our customers for this product did not have a straightforward solution to consider for their DDR-333 stacking requirements. "CS-Stack(TM) is based on the time-tested principles we have used in manufacturing millions of LP-Stacks(TM) -- no pre-processing of FBGA components are required, the base materials added to the stack are widely available, and the design rules used facilitate multiple material suppliers. Unlike other proposed products that rely on proprietary memory module designs, CS-Stack(TM) is expected to be compatible with industry-standard proposals." It is expected that CS-Stack(TM) products will begin shipping samples to customers concurrent with the release of DDR-333 DRAM samples in the fourth quarter of this calendar year, and production will begin in 2002. About DPAC Technologies Based in Garden Grove, DPAC Technologies Advanced Packaging Group provides patented component packaging technology to create high-density, space-saving surface mount electronic components. DPAC's products are used in electronic circuits found in network servers, computer storage devices, medical instrumentation and communication devices. The company's System Design Group provides outsourced engineering design services to aid customers in creating cost-saving circuit designs. The Value Added Value Added The enhancement a company gives its product or service before offering the product to customers. Notes: This can either increase the products price or value. Manufacturing Group provides contract manufacturing of prototype designs and medium volume production runs of circuit boards. DPAC's mission is to provide products and services for the Integration Age. Investor information is available through their corporate headquarters investor relations Investor relations The process by which the corporation communicates with its investors. department at 714/898-0007 ext. 128, or contact Joe Zappulla at Wall Street Investor Relations at 212/973-0883. Visit the DPAC Web site at www.DPACtech.com. This news release includes forward-looking statements forward-looking statement A projected financial statement based on management expectations. A forward-looking statement involves risks with regard to the accuracy of assumptions underlying the projections. , including statements regarding the management's current beliefs concerning the company's market, technology development, expansion and business plans, relationships in price parity parity or space parity, in physics, quantity that refers to the relationship between an object or process and the image that it can produce in a mirror. of existing technology with future technology, the need for emulation (architecture) emulation - When one system performs in exactly the same way as another, though perhaps not at the same speed. A typical example would be emulation of one computer by (a program running on) another. products, which are subject to change as a result of various risks or uncertainties. Every statement herein that is not historic in nature is a forward-looking statement. These factors would include, but are not limited to, challenges in integrating technologies or operations efficiently, protection of technology or proprietary rights, risks of litigation An action brought in court to enforce a particular right. The act or process of bringing a lawsuit in and of itself; a judicial contest; any dispute. When a person begins a civil lawsuit, the person enters into a process called litigation. , and others, and the uncertainty of successful qualification of its products by potential customers. The actual results may materially differ from those described in any forward-looking statement. Important factors that may cause actual results to differ are set forth in the company's periodic filing with the U.S. Securities and Exchange Commission including its Form 10-KSB for the year ended Feb. 28, 2001 or subsequent Forms 10-Q. |
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