DPAC Technologies Elects John Hohener as New Board Member.Business Editors GARDEN GROVE, Calif.--(BUSINESS WIRE)--Nov. 6, 2002 DPAC DPAC Denver Performing Arts Complex (CO, USA aka: DCPA) DPAC Deferred Policy Acquisition Costs (insurance) DPAC District Parent Advisory Committee DPAC Dover Partnership Against Crime Technologies Corp. (Nasdaq: DPAC), a provider of patented stacking technology for high-density, space-saving electronic components today announced that John Hohener, 47, has joined the DPAC Technologies Board of Directors. Mr. Hohener is currently senior vice president and chief financial officer of TRC TRC Noun (in South Africa) Truth and Reconciliation Commission: a commission which encourages people who committed human rights abuses or acts of terror during the apartheid era to reveal the truth about their crimes in return for immunity from prosecution Companies, Inc. (NYSE NYSE See: New York Stock Exchange : TRR TRR Transportation Research Record (Journal) TRR Test Readiness Review TRR Target Ranging Radar TRR Total Rate of Return TRR Taiwan Research Reactor ). Commenting on the addition to the DPAC Board, Chairman Richard Dadamo said, "I believe John will make a substantial contribution to the DPAC Board. He has financial and operational background in this industry and is well-known in the investment community. We are pleased to have John join our Board." "Joining the DPAC Board at this time is tremendously exciting," said Hohener. "DPAC has seen good success in its stacking products and is now transitioning to new technologies. My job will be to support the management team and to assure that the Company achieves its strategic goals." John Hohener has been chief financial officer and senior vice president of TRC Companies since June 2002. TRC is an engineering services firm that provides and implements sophisticated and innovative solutions to the environmental, infrastructure, power and transportation markets. Immediately prior to TRC he was the CFO See Chief Financial Officer. of Entridia Corporation, a start-up fabless semiconductor company A fabless semiconductor company specializes in the design and sale of hardware devices implemented on semiconductor chips. It achieves an advantage by outsourcing the fabrication of the devices to a specialized semiconductor manufacturer called a semiconductor foundry or "fab. . Mr. Hohener was the Co-founder, Vice President, CFO and Treasurer of Smartflex Systems, a high tech electronics contract manufacturer with annual revenues of $180M. Started in 1988, he took Smartflex public in 1995 and was instrumental in implementing the company's growth and diversification strategy through three major acquisitions in 1998 and 1999. He was also a key player in the ultimate sale of the company in late 1999. From 1980 to 1988, Mr. Hohener previously served as the Director of Corporate Accounting at Silicon Systems, since sold to Texas Instruments, where he was a key player in the company's IPO (Initial Public Offering) The first time a company offers shares of stock to the public. While not a computer term per se, many founders, employees and insiders of computer companies have found this acronym more exciting than any tech term they ever heard. , secondary offering, and international expansion. Mr. Hohener has a BS degree from the University of California at Berkeley (body, education) University of California at Berkeley - (UCB) See also Berzerkley, BSD. http://berkeley.edu/. Note to British and Commonwealth readers: that's /berk'lee/, not /bark'lee/ as in British Received Pronunciation. and an MBA from Pepperdine University. About DPAC Technologies Based in Garden Grove, California Garden Grove is a city centrally located in northern Orange County, California, United States. As of 2004, the city population was 170,000 people. California State Route 22, also known as the Garden Grove Freeway, passes through the city from east to west. , DPAC Technologies provides patented component packaging technology to create high-density, space-saving surface mount electronic components. DPAC's products are used in electronic circuits found in network servers, computer storage devices, guidance systems, medical instrumentation, and communication devices. The Company provides outsourced engineering design services to aid customers in creating cost-saving circuit designs as well as contract manufacturing of prototype designs and medium volume production runs of assembled circuit boards. The Company's Web site address is www.DPACTech.com. Safe Harbor and Fair Disclosure Statement The statements contained in this release which are not historical facts (such as statements in the future tense and statements including "believe," "expect," "intend," "anticipate," and similar concepts) are forward-looking statements that involve risks and uncertainties, including, but not limited to DPAC's ability to successfully design and utilize the licensed technology, the economic performance of the electronics and technology industries, the risk of customer delays, changes, or cancellations in both on-going and new programs, DPAC's ability to secure new customers and maintain its current customer base, the manufacturability of stacked chip scale packaging (hardware) Chip Scale Packaging - (CSP) A type of surface mount integrated circuit packaging that provides pre-speed-sorted, pre-tested and pre-packaged die without requiring special testing. An example is Motorola's Micro SMT packaging. , material costs fluctuations, the market need of such technology, the effects of changes in average selling prices, the effect of start-up costs of new programs and facilities, the effect of general economic conditions and world events, the impact of increased competition and the risks of patent litigation An action brought in court to enforce a particular right. The act or process of bringing a lawsuit in and of itself; a judicial contest; any dispute. When a person begins a civil lawsuit, the person enters into a process called litigation. . More information about the risks and challenges faced by DPAC Technologies Corp. is contained in the Securities and Exchange Commission filings made by the Company. DPAC Technologies Corp. specifically disclaims any obligation to update or revise any forward-looking statements whether as a result of new information, future developments or otherwise. |
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