DMEL, Inc. Offers 0.18 Micron TSMC-Specific Embedded DRAM IP; Test Chip Expected to Achieve New Speed and Density Standards.

Business Editors and High-Tech Writers

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 26, 2000

DMEL, Inc. today said it will provide TSMC process-specific 0.18 micron embedded DRAM macro cells to the SOC design community. Using TSMC's 0.18 micron technology, DMEL will design and prototype a range of embedded DRAM macro cells for use by customers in their integrated circuit designs. DMEL will provide macro cells with random access times to sub-8ns and burst mode performance to 300MHz. TSMC has already successfully demonstrated DMEL's embedded DRAM at 0.25 micron and is now focused on providing this important capability in 0.18 micron technology. DMEL expects to accept design starts for the 0.18 micron embedded DRAM macro cells in the third quarter of this year.

"DMEL has been focusing on embedded DRAM since its founding," said Paul OuYang, Chairman and CTO of DMEL. "Today, DMEL offers embedded DRAM with speeds that compete with fast SRAM enabling greater density and higher performance embedded memory for system-on-a-chip designs," OuYang continued. The high speed of DMEL's embedded DRAM IP is made possible by several proprietary features.

Both DMEL and TSMC have invested heavily in embedded DRAM. While DMEL has focused on circuit and array implementation, TSMC has developed the foundation DRAM memory cell for use with its CMOS logic based embedded DRAM process.

"TSMC views embedded DRAM as a strategic technology that is essential for many system-on-a-chip solutions. By teaming up with IP providers like DMEL, we can deliver high performance, ready-to-use technology to our mutual customers," said Edward Chen, director of special technology marketing at TSMC.

Designers will be able to access the embedded DRAM macro cells directly from DMEL. DMEL can develop either a custom macro cell or a compiled macro cell, depending upon the customer's need. DMEL automatically generates the memory cell array in both custom and standard configurations, and draws from a library of interface and DRAM control circuits. The macro cells are then prototyped by TSMC and characterized by DMEL. DMEL macro cells that are being verified today in TSMC's 0.18 micron embedded DRAM have 32-megabit and 4-megabit sizes. Additional designs are currently under development. DMEL has the capability to offer DRAM macro cells with the following characteristics:

-- Random access at 8ns

-- Page Mode Access at 300MHz

-- Choice of interfaces: SDRAM, synchronous SRAM like, or custom

interface

-- Bandwidth to 38 GB/s (gigabytes per second) (256 Gb/s)

Embedded DRAM is a significant milestone for making systems-on-a-chip a reality in many communications, networking, personal computing, and portable electronics applications. Standard embedded DRAM macro cells will be available up to 64 Megabits in the 0.18 micron technology.

About DMEL

DMEL is a privately funded company founded in 1995 with the mission of offering innovative solutions to companies requiring high-end system-on-chip products. DMEL has deployed its technology to offer standard products such as a 2Mbit EDO DRAM in 1996 up to a 64Mbit SDRAM today. DMEL will be announcing additional standard products in the near future that feature high-speed low-noise interface in standard CMOS and power control devices. DMEL is based in Santa Clara, California. More information is available through the World Wide Web at http://www.dmel.com.

About TSMC

TSMC is the world's largest semiconductor foundry, providing the industry's leading process technology, library and IP options, and other leading-edge foundry services. With the merger of WSMC and TSMC (effective June 30, 2000), TSMC is constructing or operating 11 fabs and has substantial capacity commitments at three additional facilities jointly operated by TSMC and its partners. In 2000, TSMC expects to have the capacity for nearly 3.4 million 8-inch equivalent wafers. Fabrication processes offered by TSMC include CMOS logic, mixed-mode, volatile and non-volatile memory, and BiCMOS. TSMC's corporate headquarters are in Hsin-Chu, Taiwan. More information about TSMC is available through the World Wide Web at http://www.tsmc.com.