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DDi gets stacked.


DDi Corp. (ddiglobal.com) has unveiled a patented technology for reducing layer count in PCBs. Stacked MicroVia, or SMV SMV
abbr.
slow-moving vehicle
, describes 0.004" laser-drilled holes, each plated with copper, used to create blind and buried bur·y  
tr.v. bur·ied, bur·y·ing, bur·ies
1. To place in the ground: bury a bone.

2.
a. To place (a corpse) in a grave, a tomb, or the sea; inter.

b.
 stacked microvias on any layer. This permits the escape or fanout of high I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output.

I/O - Input/Output
 BGAs on multiple layers as well as 0.4 to 0.8 mm fine-pitch devices. Separately, DDi in February filed an application to list its common stock on the Nasdaq.
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Article Details
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Author:Shaughnessy, Andy
Publication:Printed Circuit Design & Manufacture
Geographic Code:1USA
Date:Apr 1, 2004
Words:79
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