DALSA selects EV Group to supply MEMS wafer bonding equipment.EV Group (EVG EVG Elektronisches Vorschaltgerät (German: Electronic Ballast) EVG Enterrement de Vie de Garçon (French) EVG Evaluator Group , Scharding, Austria, www.evgroup.com), a manufacturer of microelectromechanical systems See MEMS. (MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. ), nano (1) Billionth (10 to the -9th power). See space/time. (2) Refers to the nanotech industry in general. See nanotechnology. (3) See iPod nano. and semiconductor wafer processing equipment has been selected by DALSA Semiconductor (Waterloo, ON, Canada, www.dalsa.com), a supplier of specialized and custom wafer foundry services, as the strategic supplier for MEMS wafer bonding and thick polymer lithography semiconductor production equipment. Initially, EVG will provide DALSA with the GEMINI Wafer Bonder Cluster tool and the HERCULES Thick Polymer Lithography tool customized to DALSA's specifications. The systems will be the key to move MEMS into the high-volume manufacturing (HVM HVM High Volume Manufacturing HVM Hardware Virtual Machine HVM High Velocity Missile HVM Hypervelocity Missile HVM Havre, Montana (border patrol sector) HVM High Velocity Machines ) spotlight. Later, the two parties intend to cooperate to enhance the capabilities of the equipment sub-modules to handle new materials and processes. DALSA expects preliminary equipment operation in four to six months. The two high-volume production systems from EVG will enhance DALSA's MEMS production capabilities--especially in the areas of intelligent MEMS and low temperature process. |
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