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Cypress and Silecs Jointly Evaluate Non-Porous, Low-k Materials for Integrated Circuits.


Business Editors/High-Tech Writers

SAN JOSE San Jose, city, United States
San Jose (sănəzā`, săn hōzā`), city (1990 pop. 782,248), seat of Santa Clara co., W central Calif.; founded 1777, inc. 1850.
, Calif.--(BUSINESS WIRE)--Feb. 10, 2004

Program Seeks to Improve Yield, Reduce Costs and Improve Device

Performance Utilizing Silecs' Proprietary Low-k Dielectric Technology

Cypress Semiconductor Cypress Semiconductor is a semiconductor design and manufacturing company. It began operations in 1982 and listed publicly in 1986. Two years later, the company shifted over to the New York Stock Exchange under the symbol, (NYSE: CY).  Corp. (NYSE NYSE

See: New York Stock Exchange
:CY) and Silecs, Inc. announced today that the two companies have agreed to collaborate on the development and testing of Silecs' novel, non-porous, low-k dielectric materials Dielectric materials

Materials which are electrical insulators or in which an electric field can be sustained with a minimal dissipation of power. Dielectrics are employed as insulation for wires, cables, and electrical equipment, as polarizable media for
 in certain devices manufactured by Cypress. The key objectives are to improve speed performance, lower power consumption, reduce manufacturing costs and improve overall device yield. This project is part of Cypress's efforts to develop a robust low-k process for use in device manufacturing.

Low-k dielectrics are used in the manufacturing of advanced integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for  (IC) devices and are essential to achieve high-speed performance and reduced power consumption. Low-k materials, particularly porous low-k films, have proven difficult to integrate into the IC manufacturing processes. This is mainly due to their insufficient thermo-mechanical robustness, absorption of wet chemicals during processing and mismatches in thermal expansion thermal expansion

Increase in volume of a material as its temperature is increased, usually expressed as a fractional change in dimensions per unit temperature change.
 characteristics with interconnect metals. Through molecular engineering, Silecs has developed non-porous, low-k materials to specifically overcome these issues.

"This agreement represents a natural extension of the work that has been underway at Cypress over the past year," said Dr. Jason Reid, director of engineering at Silecs. "In the work we have done thus far, we have shown the capability of our product to significantly reduce interline in·ter·line 1  
tr.v. in·ter·lined, in·ter·lin·ing, in·ter·lines
To insert between printed or written lines.



in
 capacitance, as well as its potential to eliminate certain costly manufacturing process steps due to superior planarization properties. It's time It's Time was a successful political campaign run by the Australian Labor Party (ALP) under Gough Whitlam at the 1972 election in Australia. Campaigning on the perceived need for change after 23 years of conservative (Liberal Party of Australia) government, Labor put forward a  now to demonstrate improved overall device performance and manufacturing yield."

"We welcome the opportunity to continue this technical evaluation with Silecs," said Bert Bruggeman, director of technology development at Cypress. "The Silecs technology has proved very promising in the past several months and offers an exciting, fresh approach to the implementation of low-k dielectrics in IC devices. We hope to demonstrate significant operating cost savings through the elimination of one or more dielectric chemical-mechanical polishing (CMP CMP (cytidine monophosphate): see cytosine.


(1) (CMP Media LLC, Manhasset, NY, www.cmp.com) Part of United Business Media, CMP is a leading integrated media company that offers a wide variety of publications and services in the information
) process steps while improving the overall performance of our products."

About Cypress

Cypress Semiconductor Corp. (NYSE:CY) is Connecting from Last Mile to First Mile(TM) with high-performance solutions for personal, network access, enterprise, metro switch and core communications-system applications. Cypress Connects(TM) using wireless, wireline, digital, and optical transmission standards, including USB USB
 in full Universal Serial Bus

Type of serial bus that allows peripheral devices (disks, modems, printers, digitizers, data gloves, etc.) to be easily connected to a computer.
, Fibre Channel, SONET/SDH, Gigabit Ethernet and DWDM (Dense WDM) The term given to wavelength division multiplexing (WDM) when significantly more channels were being added. Since WDM is increasingly more "dense" all the time, both terms are used synonymously. See WDM.

DWDM - wavelength division multiplexing
. Leveraging its process and system-level expertise, Cypress makes industry-leading physical layer devices, framers and network search engines, along with a broad portfolio of high-bandwidth memories, timing technology solutions and reconfigurable mixed-signal arrays. More information about Cypress is accessible online at http://www.cypress.com/.

About Silecs

Silecs develops electronic chemical products specifically designed to meet the advanced requirements of the semiconductor industry, leveraging an extensive portfolio of patent pending precursor and synthesis technologies. With its application engineering strength and extensive semiconductor processing facilities at its disposal, Silecs is able to develop advanced semiconductor processes to help customers in rapid product integration. Additional information on Silecs can be found online at www.silecs.com.

Cypress and the Cypress logo are registered trademarks of Cypress Semiconductor Corporation. "Connecting from Last Mile to First Mile," and "Cypress Connects" are trademarks of Cypress. All other trademarks are the property of their respective owners.
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No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2004, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Business Wire
Date:Feb 10, 2004
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