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Coviant Selects Palomar Technologies to Automate Optical Manufacturing; Leading Provider of Manufacturing Services Applies Automation to Prototype and Volume Production.


Business Editors/High-Tech Writers

VISTA, Calif.--(BUSINESS WIRE)--June 18, 2003

Palomar Technologies today announced that Coviant, a global provider of optical manufacturing services, has selected Palomar's automated assembly systems for precision placement and bonding of optical components.

Coviant designs, develops, manufactures and tests optoelectronics components and sub-assemblies for the telecommunications, defense, aerospace, medical and industrial markets.

"We use the Palomar equipment to make a broad range of products, including planar A technique developed by Fairchild Instruments that creates transistor sublayers by forcing chemicals under pressure into exposed areas. Planar superseded the mesa process and was a major step toward creating the chip.  wave guide circuits, transceivers, receivers, transponders, detectors and high power LED assemblies," said Robert Irvin, VP of engineering of Coviant. "Different products have different requirements for placement accuracy and bonding. With Palomar's automated equipment, we can achieve 3-5 micron placement accuracy. We also have the option of using in-situ bonding, and reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text.  bonding for specific types of applications. We were very impressed with the versatility of the Palomar equipment."

In manufacturing high precision optical components and subcomponents for the telecommunications industry, Coviant uses unique proprietary methodologies to streamline complex optical assembly and incorporates specialized manufacturing methodologies that improve quality and reliability. Coviant uses Palomar's Laser Diode A semiconductor-based laser used to generate analog signals or digital pulses for transmission through optical fibers. Both laser diodes and LEDs (light-emitting diodes) are used for this purpose, but the laser diode generates a smaller beam that is easier to couple with the smaller core  Assembly (LDA (Local Delivery Agent) Software in a mail server that delivers mail to a local recipient. See messaging system. ) machine to replace manual assembly processes with high-precision automation for both prototype and high volume production.

Palomar's LDA automatic component assembly system uses a patented heat process that controls the temperature required for proper die attach. Its spacious 700 square inch work area accommodates a high mix of components in waffle See WAFL.  pak, gel pak, tape and reel, and wafer formats. Designed to fully automate complex laser diode component assembly, the LDA achieves high placement accuracies with advanced, vision-guided placement, replacing tedious and error prone manual processes.

About Palomar Technologies

Palomar Technologies is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronic, RF and microelectronic packages in the photonic Dealing with light (photons). See photon and photonics. , wireless, microwave, automotive, aerospace, medical and life sciences industries. Established in 1975 as part of Hughes Aircraft Hughes Aircraft Company was a major aerospace and defense company founded by Howard Hughes. The group was based near Ballona Creek, in Culver City, California, USA, on the Pacific Coast.

Hughes Aircraft was acquired by General Motors in 1985.
 Co., Palomar has been an independent company since 1995.

Palomar products include high accuracy component assembly with eutectic solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i.  or epoxy epoxy

Any of a class of thermosetting polymers, polyethers built up from monomers with an ether group that takes the form of a three-membered epoxide ring. The familiar two-part epoxy adhesives consist of a resin with epoxide rings at the ends of its molecules and a curing
, precision ball bonding Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of semiconductor device fabrication. , and wedge bonding for fine pitch devices. Palomar's Process Development and Prototyping Services assists companies in developing or validating new products by providing design, engineering, prototyping, assembly and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. Visit Palomar's Web site at www.palomartechnologies.com.

For more information, contact the Palomar office in your area:

Palomar Technologies Inc.               Palomar Technologies Pte Ltd
Tricia McGough                          Wai Seng Chew
2230 Oak Ridge Way                      192 Pandan Loop #07-08/09
Vista, Calif. 92083                     Singapore 128381
Phone 760/931-3440                      Phone (65) 6779 2766
Fax 760/931-3444                        Fax (65) 6779 7939
tmcgough@bonders.com                    wschew@bonders.com

Palomar Technologies GmbH               AR Marketing Inc.
Josef Schmidl                           Andrea Roberts
Am Weichselgarten 30b                   PO Box 501528
91058 Erlangen, Germany                 San Diego, Calif. 92150
Phone 49-9131-48009-30                  Phone 858/451-8666
Fax 49-9131-48009-55                    Fax 858/451-8777
jschmidl@bonders.com                    aroberts@san.rr.com
COPYRIGHT 2003 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2003, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Business Wire
Date:Jun 18, 2003
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