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Corporate Profile for Kulicke & Soffa Industries Inc., dated March 29, 1996.


--(BUSINESS WIRE)--The following Corporate Profile is available for inclusion in your files. News releases for this client are distributed by Business Wire and also become part of the leading databases and information services See Information Systems. .

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Published date:   March 29, 1996


Company name:     Kulicke & Soffa Industries Inc.


Address:          2101 Blair Mill Road
                  Willow Grove, PA 19090


Telephone No.:    215/784-6000


Chief Executive
 Officer:         C. Scott Kulicke
                  Chairman & Chief Executive Officer


Chief Financial
 Officer:         Clifford Sprague
                  Sr. Vice President & CFO


Investor Relations
 Contact:         James Chiafery
                  Director, Investor Relations
 Business number: 215/784-6436


Public Relations
 Contact:         Ed DiMingo  Director, Corporate Communications
 Business number: 215/784-6820


Trading symbol:   KLIC


Industry:         Semiconductor assembly equipment-0-


Company description: Kulicke & Soffa Industries Inc. designs, manufactures and markets capital equipment, related spare parts Spare parts, also referred to as Service Parts is a term used to indicate extra parts available and in proximity to the mechanical item, such as a automobile, boat, engine, for which they might be used.

Spare parts are also called “spares.
 and expendable tools and materials used to assemble semiconductor devices. The company also services, maintains, repairs and upgrades assembly equipment. According to according to
prep.
1. As stated or indicated by; on the authority of: according to historians.

2. In keeping with: according to instructions.

3.
 VLSI VLSI: see integrated circuit.


(1) (Very Large Scale Integration) Between 100,000 and one million transistors on a chip. See SSI, MSI, LSI and ULSI.

(2) (VLSI Technology, Inc., Tempe, AZ, www.semiconductors.
 Research, K&S is the world's largest supplier of semiconductor assembly equipment. The company offers systems that address a broad range of applications in the assembly process, including wire bonding Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication.

The wire is generally made up of one of the following:
  • Gold
  • Aluminum
  • Copper
 systems, wafer dicing saws and die, TAB and flip-chip bonders. Through its American Fine Wire and MicroSwiss subsidiaries, the company offers expendable tools and materials, including bonding wire, die collets, capillaries and wedges. Sales for the fiscal year ended Sept. 30, 1995 were $304,509,000, with a net income of $42,822,000, or $2.22 per share.

Sales for the second quarter of 1996, which ended March 31, 1996, were $51,459,000. Net income was $16,337,000, and earnings per share were 82 cents.

CONTACT: Kulicke & Soffa Industries Inc.
COPYRIGHT 1996 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 1996, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Business Wire
Date:Mar 29, 1996
Words:313
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