Cookson Electronics and Microbonds Form Alliance on Plaskon(R) and X-Wire(TM) Technology.ALPHARETTA, Ga. & TORONTO -- Cookson Electronics - Semiconductor Products, a division of Cookson Group Cookson Group plc is a leading materials technology company headquartered in London, England, which provides materials, processes and services to customers worldwide. The Group's operations are formed into three divisions – Electronics, Ceramics and Precious Metals. plc and Microbonds Inc. (a private Canadian corporation) today announce a co-development project to align the technology roadmaps The context of product management The existence of product managers in the product software industry indicates that software is becoming more and more commercialized as a standard product. of Microbonds' insulated wire wire covered with some nonconducting material, such as plastic or silk, for use in conducting electricity. See also: Insulated bonding technology known as X-Wire(TM) Technology, with the Plaskon (R) molding compounds of Cookson Electronics - Semiconductor Products division. Cookson Electronics is a premier supplier of advanced materials Advanced Materials is a leading peer-reviewed materials science journal published every two weeks. Advanced Materials includes Communications, Reviews, and Feature Articles from the cutting edge of materials science, including topics in chemistry, physics, for the Semiconductor Packaging industry, providing integrated technology solutions for a vast array of the most advanced semiconductor packages in the market. Microbonds' X-Wire(TM) Technology insulates gold and copper bonding wires used to connect the silicon die with the package device. Insulating bonding wires enables a number of industry trends currently impeded im·pede tr.v. im·ped·ed, im·ped·ing, im·pedes To retard or obstruct the progress of. See Synonyms at hinder1. [Latin imped by the limitations of bare bonding wires which short out the device when they touch. Specifically in order to accommodate industry trends toward thinner diameter gold wires, longer wires, stacked die for wireless applications and other 3D packaging requirements, insulating the bonding wires provides the package designer and the assembler Software that translates assembly language into machine language. Contrast with compiler, which is used to translate a high-level language, such as COBOL or C, into assembly language first and then into machine language. with more options to achieve their technical and economic objectives. The joint technical effort between the Plaskon(R) family of mold compounds and Microbonds X-Wire(TM) Technology will provide common customers with cost effective wire bond and package molding flexibilities. "The ongoing need to cost effectively mold ever smaller package sizes and types, while maintaining or increasing electrical and yield performance, is beginning to push the limits of molding bare bonding wires. Microbonds' X-Wire Technology is a complementary and innovative solution that enhances molding capabilities that we are happy to support for the mutual benefit of our customers and the industry," said Scott Craig, Senior VP & General Manager, Cookson Electronics - Semiconductor Products. John Scott There are many people who have been called John Scott: Politicians
tr.v. in·su·lat·ed, in·su·lat·ing, in·su·lates 1. To cause to be in a detached or isolated position. See Synonyms at isolate. 2. bonding wire is maturing into a robust and scaleable interconnect (1) To attach one device to another. (2) A physical port (plug, socket) or wireless port (transmitter, receiver) used to attach one device to another. option. Specifically, the integration of X-Wire Technology with the Plaskon(R) leading molding compounds will provide customers new flexibility in the development and assembly of high performance-to-cost packaged ICs." About Cookson Electronics - Semiconductor Products Cookson Electronics - Semiconductor Products, a division of the Cookson Group plc, is the world's premier supplier of leading edge technologies for a vast array of applications of the Semiconductor Packaging Industry. With annual sales in excess of $1 billion, Cookson Electronics is the 3rd largest materials supplier to global electronics manufacturers industry. For more information, see www.cooksonelectronics.com. About Microbonds Microbonds, Inc. is the leading developer and licensor of insulated wire bonding technologies for use in the design and assembly of microelectronic devices. The company's X-Wire(TM) Technology has recently received a Technology Innovation Award from SEMI(R). For more information, see www.microbonds.com Cookson Electronics is a trademark of the Cookson Group. Microbonds and X-Wire Technology are trademarks of Microbonds, Inc. All other trademarks and registered trademarks are the property of their respective owners. |
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