Compositech Ltd. Receives Endorsements from Key Customers and OEM's to Support Launch of Licensing Program.

Business Editors/Technology Writers

HAUPPAUGE, N.Y.--(BUSINESS WIRE)--March 22, 2000

Compositech Ltd. (Nasdaq:CTEK), a developer of high tech laminates for the printed circuit board industry, announced today that it has launched its licensing program by sending proposals to a limited number of select candidates. Additionally, several key Compositech customers and OEMs desirous of obtaining a continued supply of the Company's CL200+(TM) laminates sent letters of recommendation in support of the program.

"We are encouraged by the response we received from our customers and OEMs to aid us in our licensing program," said Compositech Chairman and CEO Jonas Medney. "We believe licensing is the best way for our innovative CL200+ laminate to achieve the most impact in the market and simultaneously accrue the greatest benefit to our Company."

The following are excerpts from the letters Compositech received:

"Lucent Technologies (NYSE:LU) is interested in PCB laminate improvements in dimensional stability. We have worked with several of our suppliers over the past two years to evaluate your CL200+ material, and the initial data shows this laminate has the potential to significantly improve hole to internal land registration. This could be very important to increase board density for oversized high layer count backplanes, and it may allow the use of some high density BGA components without the increased expense of using micro-via technology."

"Best wishes in your efforts to license the CL200+ laminate technology," wrote Melvin Wilson, Distinguished Member of Technical Staff, Interconnect Technology, Bell Labs, Lucent Technologies.

"Sun Microsystems (Nasdaq:SUNW) feels that (the CL200+) laminate technology is an excellent solution for thinner materials and for the improved dimensional stability that is required for complex printed wiring boards. A combination of Compositech's proven technology in the hands of a company that has the resources to bring it into mass production is an exciting prospect," wrote Michael Freda, Staff Engineer, Interconnect Technology, Sun Microsystems.

"Teradyne (NYSE:TER) remains keenly interested in Compositech's material. As we have discussed, your material provides the dimensional stability that our high end products need to reliably and consistently meet our customers' needs.

"...we continue to be interested in an ongoing relationship with your potential licensees and would be willing to entertain a commitment to its ongoing use," wrote Thomas A. Pursch, Manager, Components Business, Teradyne Connection Systems, Teradyne, Inc.

"Tyco (NYSE:TYC) has experienced major yield improvements in using CL200+ with some of the most difficult high layer count product produced in our Stafford facility. The jobs where CL200+ was used showed excellent fine line resolution, partly due to the smooth surface of the laminate, improved registration with minimal or no scaling factors required for phototools, and increased long-term reliability of through holes due to the higher Tg. The greatest benefit however being consistent and improved dimensional stability of thin core materials that was maintained throughout processing."

"We wish you success so it may allow us continued use of CL200+ for ongoing programs and future product," wrote Dalton R. Stelmak, Vice President Engineering, Tyco Printed Circuit Group - Stafford, a Tyco International Ltd. company.

"Our primary R&D customer is the largest manufacturer of Integrated Circuits in the world...some of the more advanced boards we have built for them has allowed them to get product tested and to market ahead of the original deadline. They could not have been built on conventional materials...

"This gave my customer a decoupling value they had never seen before. These attributes as well as improved yields and superior manufacturability are the reasons that we switched...to CL200+. When production of this material stopped so did the flow of R&D work from our customer...there is no other material or combination of materials that is as well suited to the type of product that we build...the loss of CL200+ has set us back a year, if not more," wrote Michael Chenoweth, General Manager, Proto-Tech Industries.

"In addition to the improved dimensional stability reported by Sun Microsystems, Teradyne and Tyco, the comments by Lucent and Proto-Tech are particularly significant," added Medney. "The improved hole to internal land registration referred to by Lucent would allow OEM designers to increase board density, thus adding more features, which is an important objective of high tech electronics design. The Proto-Tech comments point out another significant attribute of our laminate higher decoupling values, which makes CL200+ competitive with much higher priced specialty laminates," Medney concluded.

Compositech Ltd. has developed innovative and superior copper-clad and fiberglass epoxy laminates used to make printed circuit boards, which are essential components of personal computers, workstations, data communications, Internet servers and telecommunications equipment.

Compositech(TM) and CL200+(TM) are trademarks of Compositech Ltd.

Note: The statements made in this press release contain certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Act of 1934 that involve a number of risks and uncertainties. Actual events or results may differ from the Company's expectations. In addition to the matters described in this press release, risk factors listed from time to time in the Company's SEC reports and filings, including, but not limited to, its reports on Form 10-QSB for the quarter ended September 30, 1999, its registration statement on Form S-3 declared effective by the Securities and Exchange Commission on June 15, 1999 and its report on Form 10-KSB for the year ended December 31, 1998, may affect the results achieved by the Company.