Compeq bags ICs for flip chips.
Citing less competition, Compeq Manufacturing (compeq.com) will cut
production of substrates for flip chips A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done in favor of upon the side of; favorable to; for the advantage of.
See also: favor making HDI HDI Human Development Index (UNDP yardstick of human welfare)
HDI Help Desk Institute
HDI Humpty Dumpty Institute (New York, New York)
HDI High Density Interconnect PCBs as
well as IC substrates. Production of flip-chip IC substrates won't
be cut, the company said.
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