Comlent Starts Sampling China's First RFIC Power Amplifier -PA- for DECT Digital Cordless Phone and PAS/PHS Handsets.SHANGHAI, China -- Comlent, a fabless radio-frequency integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for (RFIC RFIC Radio Frequency Integrated Circuit RFIC Radio Frequency Interface Chip ) design house headquartered in Shanghai Zhangjiang Hi-tech Park, announced today that it has started sampling China's first RFIC PA for wireless terminals. This BiCMOS process-based PA operates at 1.9GHz and targets both the European digital cordless phone A wireless telephone that transmits to and receives signals from a base station within a range of a few hundred feet. Cordless phones are for local use and cannot travel long distances as can cellphones and satellite phones. See DECT and multihandset cordless. market which uses the Digital Enhanced Cordless Telephony (DECT (Digital Enhanced Cordless Telecommunications) A cordless phone standard mostly used in Europe; however, DECT 6.0 is increasingly used worldwide. The first DECT standards were introduced by ETSI in 1992, and DECT phones have been used as cordless home phones as ) standard and PAS/PHS handset market. Samples of the PA for the DECT phone have been available since late last year, and the qualification and certification process for the DECT handset design will be carried out in the near future. This production-ready PA is based on Jazz Semiconductor's leading BiCMOS process technology. It has a 3-stage design that offers up to 30dB gain and 24-dBm of output power. A specially designed QFN-16 package is used to provide good electrical performance and heat conduction Heat conduction or thermal conduction is the spontaneous transfer of thermal energy through matter, from a region of higher temperature to a region of lower temperature, and hence acts to even out temperature differences. . The DECT digital cordless phone market in Europe has experienced strong growth in recent years, with approximately 30 million units shipped in 2003. In addition, the existing Northern American digital cordless phone market that uses 2.4GHz DSS (1) (Digital Signature Standard) A National Security Administration standard for authenticating an electronic message. See RSA and digital signature. (2) (Digital Satellite S technology is expected to gradually adopt the DECT standard in the future, a trend that could provide further growth potential for PA products such as those provided by Comlent. Comlent's investors include leading venture capital institutional investors such as Intel Capital, 3i and Draper Fisher Jurvetson Draper Fisher Jurvetson (DFJ) is a venture capital firm based in Menlo Park, California with affiliate offices in more than 30 cities around the world and over $4.5 billion in capital commitments. , Shanghai municipal and Zhangjiang Hi-tech Park venture funds as well as top executives from several leading semiconductor companies in the US, Taiwan and Europe. "In the past two and a half years, Comlent has invested millions of US dollars in R&D to develop proprietary and patented IP for RFIC transceiver and PA designs in both CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. and BiCMOS technologies. After Comlent's recent success in sampling China's first whole RFIC transceiver, this new addition of RFIC PA product evidences Comlent's continual leadership in China," says co-founder and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. of Comlent, Dr. Kai Chen. "Comlent will relentlessly strengthen and execute our business vision and mission to provide the world class RFIC technology to our local customers, together with our strong support and quality service, in order to enable them to win in the domestic and global marketplaces." "Jazz Semiconductor Jazz Semiconductor is a US based pure-play semiconductor wafer foundry that serves customers targeting wireless, optical networking, power management, storage, aerospace/defense and other high-performance applications. is pleased to learn of Comlent's progress in addressing China, the world's largest wireless terminal market. Our partnership with China's emerging fabless RFIC design houses is important to our China strategy," stated Paul Kempf, chief technology and marketing officer at Jazz Semiconductor. "Comlent's continuous progress further reinforces our confidence and commitment to these emerging markets." About Comlent: Established in 2002, Comlent, a fabless radio frequency integrated circuit (RFIC) design house headquartered in Zhangjiang Hi-tech Park, Shanghai, China, is a leading RFIC provider that focuses on the exploding wireless communication market of China. Initial products of Comlent include RFIC transceivers in both CMOS and BiCMOS technologies for mobile handsets in 1.9GHz-2.4GHz frequency range. Comlent provides enabling RFIC technology, strong support and quality service to serve China's mobile communication market that has 300+ million mobile phone and 70 million PHS/PAS subscribers, 400 million domestic TV sets and manufacturers of 70 million cordless phone units per year. For more information, please visit www.Comlent.com. |
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