Articles from Circuits Assembly (October 1, 2009)

1-41 out of 41 article(s)

Title	Author	Type	Words
'Engineering is no. 1': why a top five fabricator sees value in diversification.		Interview	1009
'No halogen' solder paste.			85
256-nozzle inkjet printhead.			93
4 EMS firms shut down in September.	Buetow, Mike		246
4-D AOI software.			86
All for one.	Buetow, Mike		838
Anatomy of a correct thermal profile: complex, BGA-laden PCBs demand one-of-a-kind profiles.	Ilustre, Simon		1660
Antistatic-coated cover tapes.			83
Auto OEMs complete Pb-free Solder Validation Test Plan.	Buetow, Mike		379
Benchtop filling system.			88
Best practices in contract manufacturing: though different in size and scope, these six companies have long track records of success.	Sherman, Randall; Leone, Dave; Klomp, Frank	Company overview	2727
Cleaning COTS parts in military applications: why commercial off-the-shelf components are incompatible with high-rel processes.	Wolfgong, W. John		1532
Component dry storage.			82
Confidence in CE growing.	Drysdale, Chelsey		99
ECHA proposes 15 new candidate SVHCs.	Drysdale, Chelsey		122
Ensuring accurate placement in the tooling nest: combining clamping and snugging in a single board handling method.	Ashmore, Clive		654
Fine pitch interconnects.			82
In case you missed it.			803
Industry market snapshot.	Drysdale, Chelsey		109
Juki opens CA HQ.	Drysdale, Chelsey		85
Keeping connected: connector technology still grapples with smaller platforms, higher speeds and placement issues.	MacWilliams, John		2190
Limited access tools to improve test coverage: smaller test pads are overwhelming the best probing techniques.	Tek, Andrew		1157
Low viscosity fluid tips.			83
Manufacturing in black, first time in 19 months.	Drysdale, Chelsey		294
Metals index.	Drysdale, Chelsey		89
Methods for printing cell conductors: the two primary ways need more repeatable accuracy.	Brown, Darren		802
Microelectronics innovation center to be established in Quebec.	Buetow, Mike		107
Orbit One acquires Wega Electronics.	Drysdale, Chelsey		91
Pad cratering: another failure mode to worry about: larger pads and better PCB layout will reduce strain.	Tino, Ursula Marquez De; Roggeman, Brian		631
PC demand jumps in Q2.	Drysdale, Chelsey		83
Polyimibe rework stencils.			107
Premature cleaning equipment selection: chemistry cleaning trials should be conducted prior to equipment selection.	Wack, Harald		693
Seeing things: what look like open BGA joints might be tricks of the light.	Maio, Davide Di		203
Semis fly in July.	Drysdale, Chelsey		174
Solder skips: if solder isn't reaching the components, check these areas.	Lotosky, Paul		200
Static dissipative vacuum cups.			91
Terepac begins pilot production of printed silicon ICs.	Drysdale, Chelsey		91
The US Patent and Trademark Office.			115
Trends in prototyping service needs: what drives them and how can design teams optimize the process?	Benson, Duane		976
Universal test measurement.			107
Virtual manufacturing tools: special software permits factory floor adjustments, potentially saving capital investments.			923