Articles from Circuits Assembly (October 1, 2009)

1-100 out of 102 article(s) next

Title	Author	Type	Words
'Engineering is no. 1': why a top five fabricator sees value in diversification.		Interview	1009
'No halogen' solder paste.			85
'Quick cure' conductive film.			55
20-head placement machine.			74
2009 global PWB production down 20%.	Drysdale, Chelsey		75
256-nozzle inkjet printhead.			93
4 EMS firms shut down in September.	Buetow, Mike		246
4-D AOI software.			86
8-MP desktop AOI.			67
All for one.	Buetow, Mike		838
Alta Manufacturing.			37
Anatomy of a correct thermal profile: complex, BGA-laden PCBs demand one-of-a-kind profiles.	Ilustre, Simon		1660
Andy Ure.			34
Antistatic-coated cover tapes.			83
Asymtek.			15
Auto ID combination camera.			73
Auto OEMs complete Pb-free Solder Validation Test Plan.	Buetow, Mike		379
Automated stencil printer.			73
Automatic PCB center support.			62
Bader joins iNEMI as CEO.	Buetow, Mike		60
Barcode-based wip software.			76
Bath concentration monitor.			61
Benchtop filling system.			88
Best practices in contract manufacturing: though different in size and scope, these six companies have long track records of success.	Sherman, Randall; Leone, Dave; Klomp, Frank	Company overview	2727
BGA exterior inspection.			75
Bob Eulau.			44
Chase Corp.			12
Cleaning COTS parts in military applications: why commercial off-the-shelf components are incompatible with high-rel processes.	Wolfgong, W. John		1532
Component dry storage.			82
Confidence in CE growing.	Drysdale, Chelsey		99
Datest.			11
Davy Lo.			42
Digital IR sensors.			79
Disposable fluid path valve.			65
Distron Corp.			22
Double barrel syringes.			55
ECHA proposes 15 new candidate SVHCs.	Drysdale, Chelsey		122
Ensuring accurate placement in the tooling nest: combining clamping and snugging in a single board handling method.	Ashmore, Clive		654
Fast-curing encapsulants.			65
Fine pitch interconnects.			82
Heraeus, Air-Vac begin joint development of rework material.	Drysdale, Chelsey		68
Heraeus.			23
In case you missed it.			803
Industry market snapshot.	Drysdale, Chelsey		109
Inline laser marking.			65
Inovaxe.			15
Janco Electronics Inc.			12
JP Androff.			13
Juki opens CA HQ.	Drysdale, Chelsey		85
Kam Mahdi.			19
Keeping connected: connector technology still grapples with smaller platforms, higher speeds and placement issues.	MacWilliams, John		2190
Kirsten Soldering.			32
Laser barcode scanner.			75
Limited access tools to improve test coverage: smaller test pads are overwhelming the best probing techniques.	Tek, Andrew		1157
Lord Corp.			11
Low viscosity fluid tips.			83
Manufacturing in black, first time in 19 months.	Drysdale, Chelsey		294
Marantz Business Electronics.			18
Marty Crow.			44
Matric.			13
Metals index.	Drysdale, Chelsey		89
Methods for printing cell conductors: the two primary ways need more repeatable accuracy.	Brown, Darren		802
Michael McCutchen.			21
Microelectronics innovation center to be established in Quebec.	Buetow, Mike		107
MicroTech Manufacturing.			14
Minarik Drives.			13
NBS.			20
No-clean, no-halogen solder paste.			60
Noncontact video measurement.			75
Northrop Grumman.			40
Orbit One acquires Wega Electronics.	Drysdale, Chelsey		91
Pad cratering: another failure mode to worry about: larger pads and better PCB layout will reduce strain.	Tino, Ursula Marquez De; Roggeman, Brian		631
PB-free water-soluble solder paste.			72
PC demand jumps in Q2.	Drysdale, Chelsey		83
PCB Technology.			17
Plexus.			22
Polyimibe rework stencils.			107
Premature cleaning equipment selection: chemistry cleaning trials should be conducted prior to equipment selection.	Wack, Harald		693
Production Solutions.			17
Sanmina-SCI.			18
Scott R. Werner.			9
Seeing things: what look like open BGA joints might be tricks of the light.	Maio, Davide Di		203
Semis fly in July.	Drysdale, Chelsey		174
Shop floor control software.			74
SMT box contacts.			72
Software-run Contactor cleaner.			66
Solar cell metallization dryers.			79
Solder skips: if solder isn't reaching the components, check these areas.	Lotosky, Paul		200
Static dissipative vacuum cups.			91
Static pressure soldering.			50
Steven R. Cooper.			18
Sunburst EMS.			10
Terepac begins pilot production of printed silicon ICs.	Drysdale, Chelsey		91
The US Patent and Trademark Office.			115
Thermal profiling software.			68
Tim Williams.			51
Trends in prototyping service needs: what drives them and how can design teams optimize the process?	Benson, Duane		976
Universal test measurement.			107
Vince Pradier.			41
Virtual manufacturing tools: special software permits factory floor adjustments, potentially saving capital investments.			923