Articles from Circuits Assembly (April 1, 2008)

1-38 out of 38 article(s)

Title	Author	Type	Words
2008 component orders flat.	Drysdale, Chelsey		87
A logistical nightmare.	Buetow, Mike		670
A show of strength: for pull testing, setup is crucial to get the right results.			426
Back in the game.		Interview	1128
Beyond Moore's Law: SiP-based system-level integration resolves CMOS scaling limits.	Bottoms, W.R.		1596
Black pad--a scourge on your boards: the potential failure mechanism can reside randomly and unpredictably.	Zarrow, Phil		805
Bush signs export control reforms.	Buetow, Mike		424
Car electronics to grow 13% in 2008.	Drysdale, Chelsey		100
CTS acquires Orion Manufacturing.	Buetow, Mike		107
Design and modeling of high-speed, high-density 3-D CSPs and memory modules: challenges and technologies of high-speed memory systems.	Yuan, Frank Y.; Crisp, Richard		1633
Dfx for lean: designers unfamiliar with Lean can actually add process steps--and cost.	Munroe, Chris		1160
ESD control for class 0 ESDS devices: how to protect devices between 20 and 100V.	Peirce, Roger		2049
EU, US cracking down on pirated components.	Drysdate, Chelsey		210
February manufacturing fails to grow.	Drysdale, Chelsey		214
Flextronics buying Elcoteq's Russia Ops.	Buetow, Mike		170
Flextronics gobbling up Hungary workers.	Buetow, Mike		104
Foxconn constructing plant near St. Petersburg.	Drysdale, Chelsey		162
Franklin's wisdom: why "or equivalent" is the enemy of quality and consistency.	Shea, Chrys		911
Growing your brand: "prospects lie," warns Sue Mucha. Her new book tells EMS companies how to overcome that.	Buetow, Mike	Interview	2638
High durability fluid reservoir tanks.			81
High feeder count multifunctional placement.			82
Impact of soldering atmosphere on solder joint formation: a Flextronics-Vitronics Soltec collaborative investigation into techniques for reducing nitrogen consumption.	de Tino, Ursula Marquez; Barbini, Denis; Enroth, Wesley		3744
In case you missed it.			804
Industry market snapshot.	Drysdale, Chelsey		103
Metals index.	Drysdale, Chelsey		86
Navigating up.	Drysdale, Chelsey		171
Passives classification effort heating up.	Buetow, Mike		188
Process cleaning integration: removing unwanted residues is a collective undertaking.	Bixenman, Mike		547
Report: IMI 'eyeing' Vietnam.	Buetow, Mike		104
RGT to increase stake in Adeptron.	Buetow, Mike		185
Selective soldering fluxer.			90
Siements X4i placement machine.			422
Statistical gamesmanship: why the process capability index is a better way to assess equipment.	Mohanty, Rita		926
Strong demand boosts smaller display prices.	Drysdale, Chelsey		123
TGA analysis of no-clean Pb-free flux behavior: weight change as a function of time and temperature aids reflow profiling.	Barbini, Denis		733
The 'big brush off' revisited: in rework and repair, if you can't rinse, you can't clean.	Jones, Mike		1383
This year's model: proposed new ESD qualification requirements for HBM and MM.	Duvvury, Charvaka; Gossner, Harald		723
Union to fight flex plant closure in Montreal.	Buetow, Mike		176