Articles from Circuits Assembly (October 1, 2007)

1-36 out of 36 article(s)

Title	Author	Type	Words
110k cph placement.			86
A study of 0201s and tombstoning in Pb-free systems: a comprehensive DoE finds paste and placement offsets the top contributor to defects.	Neathway, Paul; Butterfield, Andrew; Chu, Quyen; Tokotch, Nick; Haddick, Robert; Peallat, Jean-Marc;		1533
Acer to acquire Gateway for $710M.	Drysdale, Chelsey		134
August manufacturing slowed slightly.	Drysdale, Chelsey		258
Australia EMS purchases local Sanmina assets.	Buetow, Mike		92
BGA assembly with low-Ag alloy spheres: are such BGAs backwards compatible with SAC 305?	Wable, Girish; Neathway, Paul		944
Cobar, Balver finalize merger.	Buetow, Mike		122
Coming up ROSA: OEMs with Pb-free solderability problems could benefit from this component and board restoration technique.			966
Continuous improvement through visual systems: the more visible abnormalities, the more apt employees are to fix them.	Hemmant, Robert		1239
Defense, semis rebound.	Drysdale, Chelsey		171
Dual camera Batch Printer.			86
Flash device programmer.			81
Flextronics to buy medical device maker.	Buetow, Mike		130
Frost: aerospace, defense face Pb-free challenges.	Drysdale, Chelsey		214
In case you missed it.			520
Industry market snapshot.	Drysdale, Chelsey		103
IPC group to study 'dump pot' specs.	Buetow, Mike		187
IPC's cost for Washington's ear? $140,000.	Buetow, Mike		135
Lenovo Aces out Acer in Q2.	Drysdale, Chelsey		112
Low-VOC aqueous cleaner.			81
Machine versatility: aspects to evaluate when considering customization.	Mohanty, Rita		858
NAM report: Labor wages on rise.	Drysdale, Chelsey		146
NBS adds procurement services.	Buetow, Mike		103
Post-wave solder bridging: bridging seems random, yet always in the same place. Why?	Diepstraten, Gerjan		686
Practical lessons for Pb-free.		Interview	872
R & D needs for packaging: WLPs may be the answer to the widening gap between device cost and packaging cost.	Adam, Joe		308
Rapid cure underfill.			81
Science Foundation Arizona issued University of Arizona associate professor of chemical engineering Anthony Muscat a $625,000 grant to find ways to cut water and other materials from electronics manufacturing.			81
Selective soldering for high-volume assembly: in an EMS environment, overall quality rose almost 80% over a conventional wave.	Grimard, Frank		873
SemiCon West recap: Palomar to add contract services.	Buetow, Mike		299
SMT assembly worst practices--101: Windex is great for windows, but not so much for PCBs.	Zapfardt, H.J.		1228
The disappearing defects: compensating for PWB positional inaccuracies in 0201s.	Shea, Chrys		1069
The learning organization: how constant searching has 'Key'ed 3 straight SEA wins.	Drysdale, Chelsey		482
Tomorrow's customers.	Buetow, Mike		784
Viscom acquires Phoseon's MX family of IR inspection systems.	Drysdale, Chelsey		121
What to look for when qualifying a new process (Part II): a post-selective soldering heating step helps flux reach activation temperature.	Munson, Terry		720