Articles from Circuits Assembly (February 1, 2007)

1-100 out of 111 article(s) next

Title	Author	Type	Words
$1B park in Vietnam next up for Foxconn.	Buetow, Mike		134
'45 [micro]m accuracy' pick-and-place.			81
'80,000 cph' placement.			53
'Green hued' Pb-free paste.			57
160 kV nanofocus x-ray.			52
20-feeder MSD cabinet.			113
A mixed technology reliability assessment: using a mix of lead and Pb-free components, the authors found failure similar mechanisms for SAC and SnPb eutectic solder.	Nahorniak, Mike		1796
A novel low melting point Pb-free solder: a SnBiX solder showed a melting point of about 186[degrees]C and cut the material cost.	Chen, Zhenhua		1605
A tale of two schools.	Buetow, Mike	Company overview	871
Adjustable thickness squeegees.			36
AIT issued patterned leadframe patent.	Buetow, Mike		164
AkroMetrix LLC.			48
All you really want to know about XRF: XRF is an effective means for validating the presence of certain restricted elements.	Zarrow, Phil		1068
Asustek Computer.			45
Asymtek.			25
AXI software handles QFNs.			57
Benchmark Electronics.			52
Benchmark Electronics.			30
Benchtop ICT.			47
Blowholes in Pb-free wave soldering: even for humidity-soaked boards, the culprit is barrel cracking.	Schouten, Gert		773
Bosch Rexroth.			56
Chinese Ministry (MII) China RoHS.			25
Class 100 cleanroom dispenser.			110
Component placement for large PCBs.			66
Confessions of a rookie manufacturing engineer: how a simple question forever altered my perspective.	Whiteman, Lee		828
Conformal coating and board cleanliness: ensuring product cleanliness and durability in any application.	DeBenedetto, Matt		1168
Correction.		Correction notice	20
Cover your shorts: dendritic growth--metallic short circuits--can be eliminated.	Munson, Terry		415
Digi-Key.			21
Dross eliminator.			38
Dual-head soldering system.			84
Electronics equipment demand to uptick in 2007.	Drysdale, Chelsey		213
EMS costs rising in China.	Buetow, Mike		71
Endicott Interconnect Technologies.			44
EU RoHS Directive.			16
Extending tip life in Pb-free hand soldering: improved heater control and tip profiles eliminate overshoot, improve thermal transfer to the joint and reduce idle temperature.	Zamborsky, Ed		1513
Factors affecting voiding in Pb-free solder joints: voiding is sensitive to a particular flux constituent, and copper pad finishes more susceptible than AuNi or immersion Ag.	Steen, H.A.H.		1938
Final EPA TRI rule eases reporting burden.	Buetow, Mike		453
Haier to take stake in Founder PC Group.	Buetow, Mike		163
Hard lessons of RoHS; Environmental legislation should do one thing: improve the environment.			1255
Heading East.		Interview	876
High speed screen printer.			51
High Tg, RoHS-compatible laminate.			70
High-speed chip placement.			39
High-speed RF connectors.			78
High-speed wire bonder.			117
Ibiden.			20
IC inventories in check, SIA says.	Drysdale, Chelsey		159
In case you missed it.			825
Indium Corp.			71
Indium Corp.			20
Industry market snapshot.	Drysdale, Chelsey		98
Innov-X.			32
Inovaxe.			23
IPC purges Government Relations committee.	Buetow, Mike		599
Isola Group.			21
iSuppli: IC sales to rise 10.6% this year.	Drysdale, Chelsey		129
Jabil Circuit.			29
Jabil completing Taiwan Green Point buy.	Buetow, Mike		129
Japan Aviation Electronics.			19
Lab-sized BGA rework.			57
Lessons from Asia: while data on emerging technology are always welcome, most want the nuts-and-bolts.	Belmonte, Joe		774
Localized cleanliness tester.			67
Low outgassing package encapsulant silicone.			47
Mathematical modeling of solder paste stenciling for process control: a DoE for characterizing solder paste stencil printing and measuring paste bricks by 3-D AOI is described.	Wright, Tim		2146
Metals index.	Drysdale, Chelsey		84
Microvia-in-pad: possible outcomes and solutions; The features that enable portable technology can cause assembly process predicaments.	Jean, Denis		2245
Mixed technology defluxer.			56
Multi-chemistry Stencil Cleaner.			73
New orders and production growing, deliveries slowing.	Drysdale, Chelsey		194
Newark InOne.			58
Offline programmable coater.			37
Omron.			27
Optical sensors for Juki pick-and-place.			50
Organic and printed electronics: the next big thing? New printing processes promise high throughput at low costs.	Zhang, Jie		2107
P. Kay Metal.			48
Parallel AOI/AXI 3-D inspection.			86
Parts programmer with 3-D inspection.			74
Pb-free hot gas rework.			71
Pb-free water-soluble paste.			56
Pb-free wave solder design guidelines: it's best to review every aspect, from pad design to lead length.	Jean, Denis		1155
PCB Design Conference East issues call for abstracts.	Buetow, Mike		155
Pentagon EMS.			15
Placement system OEM Blakell Europlacer Ltd.			46
PLM with real-time parts data.			48
Pre-production process control.			40
Printed Circuits Corp.			13
Process mapping and design: a detailed process map can help reduce everything from cycle time to defects to process steps.	Linton, Jonathan		2068
Reconfigurable PCB tester.			73
Report: China's OEMs narrowing sales gap.	Buetow, Mike		133
Report: Foxconn adding China headquarters.	Buetow, Mike		70
Robotic Process Systems.			27
Sanmina-SCI's financial woes continue.	Buetow, Mike		279
Semiaqueous flux cleaner.			82
Sensor underfill encapsulant.			90
SMT Automation line.			86
SolderStar.			39
Sparton Corp.			51
Taiyo Kasei.			19
The PCB design outsource proposition: is outsourcing the right solution for your company?	Zaccari, Joseph	Company overview	3166