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Articles from Circuits Assembly (January 1, 2006)

1-48 out of 48 article(s)
Title Author Type Words
A banner year for PCs. 177
Adhesive transfer film. 82
Automatic pin insertion. 103
Bare board tester. 83
Batch cleaner. 85
China EMS 'snapshot' released. Buetow, Mike 500
Chips in line for 10% CAGR. Norvell, Robin 288
Choosing a BGA inspection system: a review of three types of nondestructive equipment: 2-D x-ray, endoscopic and 3-D x-ray. 867
Cisco to buy Scientific Atlanta. Buetow, Mike 181
Compensating for Pb-free inspection: leaded solder joints offer perfect conditions to reflect AOI light beams. How to adjust for Pb-free parts. Kokott, Jens 658
DEK publishes Pb-free stencil guidelines. Norvell, Robin 299
Drucker's legacy. Buetow, Mike 838
Electronics MNCs seeing growth in China ops. Buetow, Mike 199
Four-gantry placement. 103
Ghosts past, present and future: why disasters (natural and otherwise) can promise future opportunities. Vardaman, E. Jan 630
Green materials to reach $8.7B by 2010. 94
Hand solder rework of Pb-free PTH and SMT packages: some pad lifting may be unavoidable, but our study found no resulting reliability failures. Donaldson, Alan 1161
In case you missed it: ball bumping. 212
In case you missed it: components. 131
In case you missed it: surface finishes. 324
Installing flash LEDs on flex: flex can save up to 70% in space or weight, but beware of improper bending. Lim, Shereen 637
Large PCB wave soldering. 84
Let's get small. Interview 803
Low pressure molding: a primer: how the process compares to potting and injection molding. Dufresne, Steven 997
Low-VOC aqueous cleaner. 83
Mentor's Expedition Enterprise: simultaneous team design using a common software, integrated flow. Krolla, Joe 646
Metals prices hitting 15-year highs. Buetow, Mike 264
Next-gen packaging tops iNEMI Research Priorities. Buetow, Mike 302
No-clean Pb-free paste. 82
Pb-free rework station. 83
Pb-free Solder Bath. 98
Pb-free wave soldering systems. 80
Precision dispensing. 97
Processes and their parameters: when updating procedures and developing processes, rely on "real world" data, not lab tests. Walter, Markus 2393
Programming with vision inspection. 85
RoHS implementation: an OEM and EMS case study: the process by which a Pb-free line was evaluated is detailed. Martindale, Guy 1328
Selective soldering system. 88
Self-cleaning Wash Tank. 83
Short sited? The 'pack' mentality may drive companies to ignore locations best-suited for their business or customers. Mucha, Susan 1653
SMT inspection. 98
Still the king of shows: three standout products made royal debuts at the world's largest electronics equipment fair. Buetow, Mike 2099
Tin whisker management guidelines, part 2: how 40 [micro]m was found to be the maximum acceptable whisker length for high-rel product, and recommended strategies for mitigation. Gedney, Ron 1526
Tyco to close 16 electronics plants. Buetow, Mike 267
U.S. manufacturing chugging along. 228
Use of closed-loop process controls in dispensing: the side-by-side effects of open- and closed-loop dispensing processes. Klocke, James Reprint 1416
Using a printer in chip attachment and encapsulation: part two of a look at how traditional SMT processes address semiconductor packaging. Ashmore, Clive 448
White residues: are they or aren't they? When it comes to white residues, a defect is not always a defect. Munson, Terry 550
Why dull or frosty Pb-free solder joints are not defective: matte or dull joints are normal and should be considered just 'an effect.'. Diepstraten, Gerjan 827

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