Articles from Circuits Assembly (December 1, 2006)

1-70 out of 70 article(s)

Title	Author	Type	Words
'Stock' response.		Letter to the editor	205
AOI for 01005 devices.			74
AOI SPC data analysis.			72
AOI with new software, GUI.			74
Ascentech.			27
Benchmark to buy Pemstar in $300M deal.	Buetow, Mike		327
Benchmark.			15
Bonso Electronics International Inc.			27
Chemical cycles.		Interview	756
China label law a sticky situation: green, blue, with or without an "e?" All that is known is there is a rule.	Drysdale, Chelsey		761
Chip interconnection design, test tool.			64
Cognex Corp.			81
Component event management tool.			73
DEK.			44
Die attachment technology: a primer on common packages and mounting methods.			624
Differences acute between EU, China RoHS laws.	Drysdale, Chelsey		739
Digi-Key.			42
Doing the Poka-yoke: avoiding cross-contamination through process verification and tracking.	Belmonte, Joe		819
Endicott Interconnect Technologies.			31
Entry-level selective soldering.			63
EU chemicals law will stretch manufacturers' resources.	Drysdale, Chelsey		710
Fabrinet.			37
Finding hidden placement problems: recalibrating equipment improves placement yields.	Voegele, Kary		765
Flexible dispense tips.			80
Flextronics.			49
Hunter Technology.			42
Identco International.			15
Improvements in Pb-free stencils: nickel has inherent benefits as a stencil medium, and refinements make it a superior choice to steel.	Zahn, Michael		968
In case you missed it.			822
Indium.			36
Industry market snapshot.	Drysdale, Chelsey		97
Interplex NAS.			32
ISM: slow growth for manufacturing industry.	Drysdale, Chelsey		203
ITW: integrating technology (big) wheels.	Buetow, Mike		706
Jabil Circuit.			64
Kemet Corp.			20
Key issues in supporting customers not transitioning to Pb-free: a standard process for developing an action plan should be used across the EMS firm's customer base.	Williams, Curt		1768
LaBarge.			32
Lean is mean.	DeMaggio, Arthur J.	Letter to the editor	199
Marshall Institute.			102
Metals index.	Drysdale, Chelsey		84
Militarily speaking.	Drysdale, Chelsey		171
Mobile device shipments on track for 1B.	Drysdale, Chelsey		95
Nam Tai Electronics.			29
National Physical Laboratory's Electronics Interconnection Group.			31
New products make their marks at AT Expo.	Buetow, Mike		403
New tools for high-mix manufacturers: how an EMS firm cut NPI setup by 1.5 to 2 times.	Bowen, Steve		454
Optimizing test requirements: ways to eliminate test steps, cut time and optimize production through collaboration.	Alkhasov, Shebetey		823
Pb, Pb-free reflow.			30
Pb-free solder joint reliability: In God we trust; all others must supply data.	Zarrow, Phil		866
Phoenix X-Ray Systems.			21
Photo Stencil.			27
Practical steps to reduce total cost of ownership: DfM is an umbrella term under which several concepts--and significant cost-savings--reside.	Ebner, Petra		435
Prism Electronics.			22
Report: active RFID market on rise.	Drysdale, Chelsey		103
Report: Pb-free still a fraction of production.	Buetow, Mike		270
Rescue cleaning of no-clean assemblies: saving hardware after a failure analysis.	Munson, Terry		584
Reworkable silicone adhesive.			97
Rotary-head parts mounter.			79
Samsung placement machines.			57
Should placement add AOI?		Letter to the editor	175
SMC.			15
Solderable coatings and Pb-free alloy combinations: the amount of each element can have wide bearing on joint properties.	Schouten, Gert		818
Solectron Corp.			53
Synova.			21
Syscom Tech.			29
TES.			47
TXP Corp.			25
VoIP a driver for telecom.	Drysdale, Chelsey		152
Yamaha.			20