Articles from Circuits Assembly (October 1, 2005)

1-36 out of 36 article(s)

Title	Author	Type	Words
'Be a manager, go to jail'.	Buetow, Mike		773
'Prevention vs. Reaction': short a standard, machine specs and performance are derived different ways.	Belmonte, Joe		783
Additional RoHS exemptions sought.	Buetow, Mike		237
Agilent to sell semi businesses.	Norvell, Robin		108
An all-silicon package? It would permit the perfect match of identical materials. So, why not?	Gilleo, Ken		587
BTU: oven maker on fire.	Buetow, Mike		791
Building in clusters: change(over) is inevitable, and assembly efficiency can be aided by intelligent feeders and better software.	Padnos, Gerry		435
Calibrating the value of execution speed: three case studies show how U.S. firms can maintain mid-volume projects.	Fraker, Bill		2030
Celestica's new driver.	Buetow, Mike	Interview	832
Direct Logix's Control Center XP.	Eichel, Leigh		360
Escape artist: design changes involving a standoff permit flux trapped under PQFNs to volatilize and escape.	Munson, Terry		667
Gartner: servers up 4.7% in June quarter.			120
Harmony across the Pacific: coping with language barriers is just one of the "tricks" of global trade.	Papandrew, Greg		768
ICs: correction ahead?			125
In case you missed it: cleaning.	Bixenman, Mike		325
In case you missed it: component assembly.	Aravamudhan, Srinivasa		208
In case you missed it: design.	Roe, Jason		111
In case you missed it: solder qualification.	Socolof, Maria		114
IPC's Bergman to keynote PCB East.	Norvell, Robin		90
Lead-free new problems--new solutions.	Kazmierowicz, Philip C.	Advertisement	681
Lead-Free or die: RoHS exemptions are a stay of execution, not a commuted sentence.	Zarrow, Phil		1198
Manufacturing still hot in August.			260
Mixed metallurgies: can SAC-finished components be soldered with SnPb? Sometimes.	Whiteman, Lee		664
No-clean Pb-free paste.			83
OEM group calls for steady supply of SnPb parts.	Buetow, Mike		155
Pb-free rework differences and practices: no lead means using four heating zones and one cooling zone for reflow.	Khan, Zulki		479
RoHS guidance notes reissued.	Buetow, Mike		138
Solderability and joint design: thermal solderability demands solder not cool below its melting point during joint formation.	Marquez, Ursula		757
Speedline CEO: Pb-free peak still ahead.	Buetow, Mike		170
Storage all full.			170
Study finds accuracy critical for Pb-free deposition.	Norvell, Robin		188
Switching to Pb-free: how difficult is it? Very, says this four-part series on materials, equipment and process considerations.	Walter, Markus		541
The relationship of components, alloys and fluxes, part 1: call it a love triangle--or a Bermuda Triangle. Either way, the best alloy may be determined by the end-application.	Lee, Ning-Cheng		1603
U.S. EMS firms poorly positioned.	Norvell, Robin		261
Valor teaming on placement calibration.	Buetow, Mike		184
When to outsource rework: breaking down the cost and quality decisions.	Wettermann, Bob		948