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Articles from Circuits Assembly (October 1, 2005)

1-80 out of 80 article(s)
Title Author Type Words
'Be a manager, go to jail'. Buetow, Mike 773
'Prevention vs. Reaction': short a standard, machine specs and performance are derived different ways. Belmonte, Joe 783
3D paste inspection. 40
Additional RoHS exemptions sought. Buetow, Mike 237
Agilent to sell semi businesses. Norvell, Robin 108
Amkor Technology. 55
An all-silicon package? It would permit the perfect match of identical materials. So, why not? Gilleo, Ken 587
Assembleon Asia Pacific. 18
Astronic Industries. 21
Asymtek. 34
Boundary scan controllers. 61
BTU: oven maker on fire. Buetow, Mike 791
Building in clusters: change(over) is inevitable, and assembly efficiency can be aided by intelligent feeders and better software. Padnos, Gerry 435
Calibrating the value of execution speed: three case studies show how U.S. firms can maintain mid-volume projects. Fraker, Bill 2030
Celestica's new driver. Buetow, Mike Interview 832
CheckSum. 13
Cirtronics. 27
Cobar Solder Products. 29
Concurrent programmer. 61
Configurable AOI. 71
Dage Precision Industries. 28
Digi-Key Corp. 16
Direct Logix's Control Center XP. Eichel, Leigh 360
Dynatech Technology. 25
Elcoteq Network Corp. 24
Elektrobit Group Plc. 29
Endevco Corp. 21
Envision Solutions. 25
Escape artist: design changes involving a standoff permit flux trapped under PQFNs to volatilize and escape. Munson, Terry 667
Feinfocus. 24
Gartner: servers up 4.7% in June quarter. 120
Hardware forecast slows in August. 59
Harmony across the Pacific: coping with language barriers is just one of the "tricks" of global trade. Papandrew, Greg 768
ICs: correction ahead? 125
In case you missed it: cleaning. Bixenman, Mike 325
In case you missed it: component assembly. Aravamudhan, Srinivasa 208
In case you missed it: design. Roe, Jason 111
In case you missed it: solder qualification. Socolof, Maria 114
Indium Corp. 53
Industry market snapshot. 70
IPC's Bergman to keynote PCB East. Norvell, Robin 90
KIC. 17
Lead-free new problems--new solutions. Kazmierowicz, Philip C. Advertisement 681
Lead-Free or die: RoHS exemptions are a stay of execution, not a commuted sentence. Zarrow, Phil 1198
Leica Microsystems. 33
Leviton Manufacturing Co. 26
Manufacturing still hot in August. 260
Mixed metallurgies: can SAC-finished components be soldered with SnPb? Sometimes. Whiteman, Lee 664
Multifunctional placer. 77
No-clean Pb-free paste. 83
OEM group calls for steady supply of SnPb parts. Buetow, Mike 155
Optimized surface analysis. 55
Parkheath. 32
Pb-Free materials. 43
Pb-free reflow oven. 67
Pb-free rework differences and practices: no lead means using four heating zones and one cooling zone for reflow. Khan, Zulki 479
Pb-free solder paste. 72
PCB/BGA X-ray inspection. 47
Purex International. 19
RoHS guidance notes reissued. Buetow, Mike 138
Rotary dispensing table. 53
Rotary placement head. 74
Schmits named president of Universal Instruments. Norvell, Robin 73
Screen printing platforms. 58
Selective soldering. 70
SMT X-ray inspection. 70
Solderability and joint design: thermal solderability demands solder not cool below its melting point during joint formation. Marquez, Ursula 757
Soldering robots. 61
Speedline CEO: Pb-free peak still ahead. Buetow, Mike 170
Storage all full. 170
Study finds accuracy critical for Pb-free deposition. Norvell, Robin 188
Switching to Pb-free: how difficult is it? Very, says this four-part series on materials, equipment and process considerations. Walter, Markus 541
The relationship of components, alloys and fluxes, part 1: call it a love triangle--or a Bermuda Triangle. Either way, the best alloy may be determined by the end-application. Lee, Ning-Cheng 1603
U.S. EMS firms poorly positioned. Norvell, Robin 261
Valor teaming on placement calibration. Buetow, Mike 184
Veris Manufacturing. 16
Viscom. 31
Wave profile fixture. 61
When to outsource rework: breaking down the cost and quality decisions. Wettermann, Bob 948
Zestron's European. 25

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