Articles from Circuits Assembly (November 1, 2005)

1-47 out of 47 article(s)

Title	Author	Type	Words
'Innovation' drives Siemens to manufacture in Singapore.	Norvell, Robin		357
0.1 cent RFID chip assembly? Technologies to slash manufacturing costs for the ubiquitous tags are being aggressively pursued.	Pristauz, Hugo		1026
12 Gb/s SMT connector.			108
A novel IR rework system: dynamic temperature control and sensors help manage heat in Pb-free processes.	Cannon, Mark		739
AT Expo exceeds expectations.	Norvell, Robin		405
Automatic AXI.			86
Bench strength.	Cowell, Mark	Interview	821
CIRCUITS ASSEMBLY opens 2006 Service Excellence Awards.	Buetow, Mike		296
Clean it up! Incoming board and component cleanliness is crucial in building reliable product.	Munson, Terry		733
Defensive swing.			169
Design for concept time: next-generation testers perform most of the heavy lifting at the wafer level.	Grundy, Peter		1483
EIA leader pushes Congress on recycling.	Buetow, Mike		295
EMS companies getting RoHS certifications.	Buetow, Mike		555
Equipment markets to slow in '06?			98
EU sets RoHS max. concentration levels.	Buetow, Mike		95
Fanning the flames: will a fire, plus much-needed patent reform, mean a healthier IC industry?	Vardaman, E. Jan		852
Flextronics confirms India plans.	Buetow, Mike		191
Flextronics, Sanmina-SCI expanding abroad.	Buetow, Mike		284
In case you missed it: chip packaging.	Jackson, John		199
In case you missed it: design.	Hartley, Rick		150
In case you missed it: PCB reliability.	Fawcett, Donna		154
In case you missed it: soldering reliability.	Wickham, Martin		234
Inline fine-pitch printer.			83
Investors acquire Leica semi unit.	Buetow, Mike		103
IPC chides EPA over TRI reform.	Buetow, Mike		232
IT budget forecast: 9% growth.			84
IT OEMs working on fan standard.	Buetow, Mike		100
ITARred and feathered.	Buetow, Mike		824
Mixed technology gets selective: selective and fountain soldering can reduce skips and opens over traditional wave processes.	Buttars, Scott		2745
Nanotech firm says solved RoHS issues.	Buetow, Mike		122
New auto EDA tools drive design time reduction.	Buetow, Mike		503
Parameters of reflow encapsulation: 'no-flow' materials cut four steps, including one dispensing step and a reflow pass.			588
Pb-free and eutectic rework.			81
Pb-free wafer bumping.			92
Precision fluid dispensing.			82
Program for calculation of flip-chip standoff height: direct calculation is important, but tedious and time-consuming. Until now, that is.	Ferguson, Frederick		726
Samsung Techwin's SM Series: in-transit component alignment, plus 3-sigma accuracy.	Foster, Mike		626
September sharp for manufacturing.			234
Shotgunning: not for Pb-free: a proper test approach can reduce scrap from random repair methods.	Oresjo, Stig		687
SiP gaining where MCMs failed.			113
Smooth transitions: project launch is distinctly different from program management, and demands its own set of procedures.	Mucha, Susan		1398
Soldering PCBs with non-plated through-holes: low-tech, single-sided boards can be complicated to solder.	Diepstraten, Gerjan		799
Supplier management services: how third parties can aid in organization, processes and metrics.	Payne, Don		442
Switching to Pb-free: wave soldering: how to adjust conveyors, pots, preheaters and solder modules for Pb-free processes.	Walter, Markus		1932
The relationship of components, alloys and fluxes, part 2: in this installment, the author reviews the interactions of fluxes with components and alloys, respectively.	Lee, Ning-Cheng		1562
Using traditional SMT processes for semiconductor packaging: a two-part look at bumping and encapsulation of flip-chip BGAs.	Ashmore, Clive		581
Zero-defect IC inspection: anyway you look at it, camera view plays a key role in defect detection.	Krippner, Peter		434