Articles from Circuits Assembly (July 1, 2005)

1-66 out of 66 article(s)

Title	Author	Type	Words
3-D packaging gets ready for prime time: among the benefits: improved RC delay and power consumption.	Vardaman, E. Jan		989
Adaptable workbench.			65
Aegis Industrial Software Corp.			38
An experimental methodology for process optimization: a 24-panel method for characterizing new soldering processes.	Oresjo, Stig		793
Assembleon CEO.			40
Asymtek.			26
AT&S.			26
BGA bumping paste.			77
Can existing tools survive Pb-free soldering? Most machines pass the test, but some key changes are ahead.	Bath, Jasbir		770
Celestica Inc.			51
China IC industry expanding rapidly.			107
Choosing the right stencil: plastic makes its mark, but for 0.5 mm pitch laser-cut or electroformed are best.	Ashmore, Clive		794
Computers booting up.			174
Cookson opens $3M China base.	Buetow, Mike		82
Dell to recycle 2k PCs for U.S. Park Service.	Buetow, Mike		236
Dispenser analysis.			61
Everett Charles Technologies.			33
Fabrinet.			35
Foxconn to buy 2 HP plants?	Buetow, Mike		111
Gantry dispenser.			55
Heart of sorrow.	Buetow, Mike		654
Henkel expands solder labs.	Buetow, Mike		95
In case you missed it.			822
Industry market snapshot.			69
Industry sees open stance from Congress on China.	Buetow, Mike		240
Inventories down, more coming.	Buetow, Mike		298
ISM: is stronger dollar hurting production?			251
Jurong High Tech.			18
LaBarge Inc.			29
Leica Microsystems.			18
Low rosin no-clean flux.			67
Manz Automation AG.			35
Mean green corrosion: avoiding residues on ImAg boards selectively soldered with no-clean flux.	Munson, Terry		648
Michael E. Marks.			29
MIMOT.			22
Naka: flat U.S. PCB sales this year.			174
Need offshore PCBs? Go local: domestic PCB makers have become a dynamic source for Asian-built product.	Papandrew, Greg		581
No fly zone.	Buetow, Mike		529
O/E component testing pitfalls: inexpensive testing for expensive components is feasible, if done correctly.	Shores, Michael C.		841
OK International.			16
Optimizing stencil design for Pb-free SMT: in quantifying the impact of solder spread on typical SMT defects, the authors devised new apertures and a new test pattern.	Shea, Chrys		2940
Parts and parcels: the case is growing for embedding passive devices.	Grundy, Peter		1044
Pb-free flip chip and CSP inspection: area arrays face higher thermal stress, leading to topside ball delamination. A review of the literature, and a novel solution.	Friedrich, Juergen		530
Post-reflow AOI.			55
ProMOS Technologies.			44
Q1 server sales up 5.3%.			83
Quieting the noise: quality wave soldering depends on control of its many parameters.	Diepstraten, Gerjan		736
Reducing BGA defects with AXI inspection: this study established the ideal sensitivity setting for catching BGA voids.	Kurwa, Murad		540
RoHS and the supply chain: if each component can be verified, then the finished product falls into place.	Reynolds, Chris		514
RoHS-compliant test points.			79
Selling EMS: using reps: part II of our look at sales strategies opines on the dynamics of hired guns.	Mucha, Susan		1159
Sergio Medrano.			18
Socket adapters.			50
Soldering iron maintenance.			84
Solectron buys Teradyne assembly plant.	Buetow, Mike		56
Specialty Coating Systems.			23
Spray fluxer.			64
Suntron Corp.			46
Texas Prototypes' Photonics division (texasprototypes.com) expanded optoelectronics testing capabilities to include high-reliability testing.			38
The basics of boundary scan: this technique permits reuse of test data and cuts costs by eliminating ICT and functional test.	Meissner, Stefan		296
The New York Stock Exchange notified EMS provider Three-Five Systems.			43
The SMT integration company.	Norvell, Robin	Interview	830
Ultrasonic Systems.			21
UMC Electronics.			34
Wetting characteristics of Pb-free alloys of interest: regardless of flux, silver-containing alloys can achieve acceptable wetting at high temperatures.	Picchione, Louis M.		340
Zestron Asia Pacific.			27