Articles from Circuits Assembly (October 1, 2004)

1-71 out of 71 article(s)

Title	Author	Words
A study of lead-free hot air leveling: controlling copper buildup in automatic soldering equipment using lead-free solder.	Suraski, David	1203
Adhesive dispenser.		37
AIM Specialty Materials.		36
Air-reflow Pb-free solder.		30
Airing it out: fumes from lead-free solders are more harmful than those of tin-lead. What precautions are you taking?	Schuepsthul, Karl	1058
August manufacturing growth slower.		288
Automated gold wire bonder.		72
Automatic cutter.		64
Azores Corp.		23
BTU International Inc.		38
Cobar Solder Products.		27
Controlling Pb-free processes through AOI: allocating test resources during qualification will reveal which method is optimum for new soldering processes.	Niermeyer, Thorsten	1174
Defluxer/cleaner.		41
DEK.		31
Direct metering pump.		63
ECS adding EMS services.	Norvell, Robin	83
electronica Expos to hit Munich, Hong Kong.	Norvell, Robin	128
Feinfocus.		40
Fine-pitch Pb-free solder.		48
FlexLink Systems Inc.		27
Flextronics acquires flex maker.	Norvell, Robin	111
Flextronics' Yi to receive SMTA Founder's Award.		256
For NPI, Texas Prototypes doesn't mess around: product launch to lifecycle management, under one roof.	Bastin, Lisa Hamburg	1627
Gartner boosts chip revenue outlook.		196
ICs turn down.		162
IMAPS.		16
IMI begins LCD shipments for Seiko.	Norvell, Robin	61
IMI: 'driving' toward tier 2.	Buetow, Mike	786
Industry market snapshot.		67
IPC.		25
Kemet Corp.		40
Label printer.		24
Lehigh student nabs Hutchins Grant.		155
Leveraging your assets: considerations for shifting to high-mix without retooling an entire line.	Robinson, Shawn	579
Machine Vision Products.		25
March Plasma Systems.		28
Micron Technology Inc.		43
Model behavior.	Buetow, Mike	857
Multi-machine inspection.		49
Multiple parts feeder.		75
NEMI revises tin whisker guidance.	Norvell, Robin	336
Pb-free 'like a massive ECO,' says Celestica GM.	Norvell, Robin	216
Pb-free fluxing.		28
Pb-free no-clean solder.		55
Pb-free x-ray.		35
Pick-and-place machine.		41
Pick-and-place software.		52
Pin inserter.		62
Plexus Corp.		38
Preventing voids in CSP and BGA underfill encapsulants: the right underfill can be as effective as the best solder paste.	Ibe, Edward	1456
Pro-Mation Inc.		37
Relearning defects: lead-free means changes in processing--and the way we assess failure mechanisms.	Crawford, Jack	526
Reptron, Clear-Com ink multimillion dollar deal.	Norvell, Robin	61
Sanmina-SCI Corp.		62
Server shipments up 25% over 2003, report says.		110
Siemens Dematic Electronic Assembly Systems.		23
Specialty Coating Systems.		37
Speedline Technologies.		53
Speedline Technologies.		17
Stable Pb-free paste.		32
Stencil us in: Speedline inks Japanese sales deal.	Norvell, Robin	65
Surface prep brushes.		31
Tabletop AOI.		47
Thanks, but I'll build it myself: eight companies list their reasons for bucking the outsourcing trend.	Gordon, Pamela J.	691
The doctor is in! Why your area array could use a good colonoscopy.	Zapfardt, H.J.	940
The remanufacturing equation: remanufacturing is a $50-billion market, and assemblers own the skills and knowledge to compete.	Linton, Jonathan D.	1386
Thermal interface film.		44
Three-Five Systems.		42
Transition Automation.		43
Wafer sort and final memory tester.		69
YESTech.		39