Articles from Circuits Assembly (November 1, 2004)

1-64 out of 64 article(s)

Title	Author	Type	Words
A supply-chain engineering solution: how "clusters" of linked world-class suppliers can create products in ways vertically integrated EMS firms cannot.	Coker, Bill		1346
A/V humming.			168
Agere's 'Nickel' defense.	Buetow, Mike		225
AIM (aimsolder.com).			16
All fluid' needles.			81
An open letter to the president.	Buetow, Mike		846
Asymtek (asymtek.com) added four teams of distributors to represent its line of automated fluid dispensing systems in China.			78
Automatic printer.			50
Backside die marking.			79
Benchmark Electronics has split its chief executive and chairman roles.			43
BGA bumping flux.			55
Board loader.			69
BTU chief executive resigns, no reason given.			57
Celestica Inc. (celestica.com) sold its Power Systems business to C&D Technologies (cdtechno.com) for $52.8 million in cash.			37
Cleanroom cabinets.			41
COMBICON THR terminal blocks.		Advertisement	58
Could technology win World War III? Tomorrow's battlefields could resemble TV shows like BattleBots.	Gilleo, Ken		692
Decrease your BGA rework cycle time.		Advertisement	29
DEK (dek.com) has joined eight other companies in Dow Corning's (dowcorning.com) External Equipment Provider Alliance.			40
Double-coated bonding adhesives.			93
Dow Corning (dowcorning.com/electronics) has signed a joint development contract with Scotland's INVINT Ltd (invint.com), to develop a variety of new interconnect technologies.			52
Getting in tune: your marketing goal: a quality value proposition aligned with the right target market.	Mucha, Susan		1872
Good bonds take time: inadequate reflow profiles cause weak joints and flex residues.	Munson, Terry		632
Gopel Electronic (goepel.com) has entered a strategic alliance under which Dansk System Elektronik (dse.dk) will offer design for test.			35
High-density connectors.			61
Hisco: inventory hawks.	Buetow, Mike		837
Hot bar soldering for flex circuits.		Advertisement	104
Industry market snapshot.			67
Is SiP haunted by the MCM ghost? Thanks to cellphones, stacked-die packages are ringing up gains.	Vardaman, E. Jan		832
John Waryold.			57
Large format rework for eutectic and lead-free applications: how the combination of low-mass IR, stationary board fixturing and gantry reflow can eliminate warping.	Kench, Stan		1918
Lead-free first-article inspection: typical process concerns associated with LF alloys for first-article OI and line qualification.	Cannon, Mark		776
Legacy Electronics (legacyelectronics.com) named Apera Technologies (aperatech.com) as sales agent in Canada.			40
Low profile conveyors.			46
Manufacturing effects on data retention of nonvolatile memory devices; can heat from wave or reflow soldering cause premature data loss?	Hirsch, Kelly		1237
Mike Tam.			22
Molex Inc. (molex.com) acquired Incep Technologies Inc. (incep.com), which provides system-level approaches for power delivery, high-density packaging and thermal management.			36
Motorola qualifies Henkel Pb-free paste.	Buetow, Mike		145
Multi-job placement.			58
Newly founded Avo Photonics (avophotonics.com), specializing in RF and optical packaging, now offers design and manufacturing solutions for communications, military/aerospace and medical/industrial.			43
Nortek Automation (nortekautomation.com) launched a turnkey packaging line for electronics manufacturing.			39
Pb-free paste.			38
Pb-free reflow and rework: key findings of NEMI experiments on process differences--and changes required--for lead-free reflow and rework.	Bath, Jasbir		2260
Preco Electronics named Thomas Goehl test engineer manager.			33
Profiling software.			52
Report: Chinese EMS, ODM to surge.			94
Ron Huston.			40
Seminar poll shows slow progress on Pb-free conversion.			240
Sept. manufacturing slightly slower.			292
Smart cars ahead?			158
SMT placement.			73
SMT Resource Group (smtresource.com) and Encore Capital Leasing rolled out a leasing program for buyers of assembly equipment.			49
Solectron, Plexus find extra capacity.	Buetow, Mike		104
Speedline awarded paste detection patent.	Buetow, Mike		91
Squeegee holder.			42
Steve Shermer.			31
Test floor monitor.			44
Thin wafer backgrinding.			51
Tin men: why Pb-free isn't free.	Buetow, Mike		774
Two-component epoxy.			105
Wafer bump reflow.			63
Welcome back.			21
With the cost of a key constituent of fluxes rising sharply, Cookson Electronics Assembly Materials (alphametals.com) will hike prices for IPA-based fluxes.			60
X-ray inspection.			58