Articles from Circuits Assembly (June 1, 2004)

Title	Author	Type	Words
A strong framework for outsourcing: think ISO/TS 16949 is just for automotive applications? Think again.	Lanigan, Jim		1864
Accton establishes UK-based product development team.			152
After China, what's next? Singaporean companies explore new frontiers in Vietnam.	Mucha, Susan		2753
Agilent, Digi-Key announce distribution agreement.			108
Alan Rae.			33
AOI in a high-mix/low-volume environment: the cost savings when using AOI can pay for the system on one job under the right circumstances.	Holzmann, Matthew		2131
APEC2000[TM] Etch-cut workstation.		Advertisement	42
Asymtek, cookson materials group collaborate on jetting underfill project.			105
Atlanta SMTA hosts successful expo.	Bastin, Lisa Hamburg		76
Celestica appoints Stephen Delaney as CEO.			155
Cookson electronics (londonderry, NH) recently expanded its polyclad laminates electronics material manufacturing facility in elk grove, CA.			31
During APEX 2004, Mike Young of Betatron Inc.			36
Electronic reprints.		Advertisement	133
ESSEMTEC production equipment for electronics.		Advertisement	83
Evaluating capital equipment: overcome the challenges of purchasing surface-mount production equipment.	Cook, Vince		555
FEINFOCUS acquired by COMET AG.			146
Flip chip capillary underfill.			89
Flip chip underfill and flux residue with lead free: this study presents data on the compatibility of 17 different flux systems with two underfill systems in a lead-free flip chip assembly process.	Carson, George		1875
Frank Marangell.			33
GATE04 Buyer-centric sourcing event set for July.			164
Get ahead of environmental compliance: redesigning to environmental requirements can provide financial benefits and competitive advantage.	Gordon, Pamela		650
High technology underfill.			52
How low can you go? Les offers tips to achieve a zero-defect line.	Hymes, Les		673
Indium to host lead-free seminar in Nuremberg.			188
Industry resources.			102
Investigating voids: does a connection exist between pad finish and voiding in lead-free assemblies?	Bryant, Keith		1705
Italian design company selects Tecnomatix solution.			94
Joe Foster.			38
Joint development of CAMX API underway.			126
Modular microscopes.			73
New Venture Research, E. J. McKay partner to develop China Solutions.			151
Non-contact measuring system.			79
PCB UPdate: news and resources for PCB industry professionals.		Advertisement	75
Phone home: can we trust telecom again?	Bastin, Lisa Hamburg		725
Preco Electronics (Morton, IL) received ITM process certification for class 2, electronics assembly.			35
Q&A with Roger Savage, president, Kester.	Bastin, Lisa Hamburg		822
Samsung Electronics joins Semiconductor alliance.			113
Self-contained gas detectors.			71
Service wins the game: "the purpose of a business is to create a mutually beneficial relationship between itself and those that it serves. When it does that well, it will be around tomorrow to do it some more."--John Woods, customer service consultant.	Norvell, Robin		658
Siemens VDO automotive has completed the acquisition of Chrysler Group's huntsville, AL, electronics operations.			32
Smart camera system.			64
SMTA offers lead-free workshop.			146
South East Asia wireless ECO process: new factory for wireless eco process.		Advertisement	67
Speedline partners with Georgia Tech's CBAR.			175
Student builds micro biosensor chip to move DNA molecules.			170
Surveys and guides.			33
Teradyne (Boston, MA) chairman and CEO George Chamillard will transition out of his CEO role over the next few months, but will continue as chairman.			32
Teradyne collaborates for entry into Russian market.			113
The truth shall make you lead free: uncovering the myths about drop-in technologies.	Hall, Jim		1510
Web sites worth mentioning.			249
X-ray inspection system.			86