Articles from Circuits Assembly (January 1, 2004)

Title	Author	Type	Words
#1--Witness the difference.			83
2-D or 3-D inspection: do you have to choose? Flexibility in x-ray inspection combines 2-D real-time imaging with 3-D axial computed tomography.	Frank, Udo E.		1213
ASAT Holdings Ltd. (Hong Kong, China) and ASAT Inc.			48
Cadence inaugurates Beijing IC system design institute.			195
Cookson Electronics launches CE Analytics.			111
DALSA selects EV Group to supply MEMS wafer bonding equipment.			148
DEK (San Jose, CA) has named Raj Lakhotia to the position of financial controller for U.S. operations.			43
ECA cautious despite continued growth in components.			189
Elcoteq, Siemens enter manufacturing agreement.			92
Feinfocus partners with BIR.			129
FlexLink Systems.			33
Future R&D for the electronics industry: who's in charge? Can the lost art of R&D be regained?	Vardaman, E. Jan		773
GE Global Electronic Solutions.			47
International Rectifier breaks ground in Xi'an.			161
IPC announces APEX/Printed Circuits Expo 2004 keynotes.			243
Is China alpha or omega for the rest of the world?			117
Juki, Universal sign business alliance.			136
Kulicke & Soffa, Nidec Tosok form alliance.			206
Lead-free solder paste.			48
Lead-free solder paste.			44
Lead-free solder paste.			103
Li appointed president of Data I/O China.			106
Manufacturing software.			85
Miniature magnetic rotary encoders.			99
Nam Tai subsidiary J.I.C. expands.			160
October 2003 Book-to-Bill.			173
Optimizing solder paste for wafer bumping: this investigation examines the variables of wafer bumping using solder paste printing techniques.	Byle, Fritz		2865
Placement head.			114
Powell-Mucha Consulting to present EMS tutorial at APEX.			207
Productronica 2003: the numbers are in.			171
Publishing an industry--consensus standard: the pros and cons of an open process.	Crawford, Jack		616
Reliable solder joints for 0201s; a summary of the eutectic and lead-free solder reliability testing that has been performed while developing the 0201 process.	Mattsson, Fredrik		1548
Reworkable underfill encapsulant.			102
RFID in the supply chain: the Wal-Mart factor.	Liard, Michael J.		370
Robotic soldering systems.			107
SMTA announces Pan Pacific Symposium program, keynotes.			188
SMTC Corp.			48
Split vision rework station.			84
Stay cool in critical applications.			67
Stencil system.			86
Supplier listings.		Cover Story	7411
Tape dispenser.			85
Tape feeders.			74
The art of negotiation.	Bastin, Lisa Hamburg		587
The latest the internet has to offer.			331
Ticona, LPFK sign license agreement.			181
Wave solder probe kit.			63
Welcome to Circuits Assembly's 2004 Buyer's Guide.		Cover Story	6810
Wolf Electronix.			43
X-ray inspection system.			78
X-ray inspection system.			89