Articles from Circuits Assembly (April 1, 2004)

Title	Author	Type	Words
Aegis launches European subsidiary.			118
AOI testing positions in comparison: an extensive study compares AOI following printing, placement and reflow, with surprising results.	Beer, Detlef		1996
Assembly insider.		Advertisement	415
Benchtop dispensing system.			138
Board support system.			144
Component orders rise in January.			307
FEINFOCUS, GOEPEL partner for AOI/AXI system.			172
First functioning 10 Gbps backplane reference design demonstrated.			256
Flip chip soldering fluxes.			88
IMAPS announces new slogan, four-tier technical program.			103
Ionizer controller.			133
It's been one of those (good) times ... IPC has stayed busy, releasing 21 standards and documents in the past three months.	Crawford, Jack		556
Kester sold to American Capital.			150
Kester--changing to meet the future of electronics.	Savage, Roger	Advertisement	940
NEMI's lead-free alloy: still applicable to today's commercially available alloys.	Handwerker, Carol		2274
News from SMART Group's Lead-Free Seminar.			153
Non-contact measurement system.			136
PDA market still evolving.			217
Plexus to supply Patientline units in UK.			128
Q & A with Raymond P. Sharpe, CEO, Cookson Electronics.	Bastin, Lisa Hamburg		990
Reflow profiling for fun and profit: save time and gain accuracy by tweaking your profiling process.	Zarrow, Phil		1113
Sanmina-SCI licenses Nortel Networks' Routing technology.			155
Screen printer.			101
SMTA International forms 2004 technical committee.			134
Solder preforms in Circuits Assembly: new solutions for old problems.	Holtzer, Mitch		1539
Speedline ships 100th dispensing system.			105
Split vision rework station.			82
Suface-mount reflow oven.			126
Temperature indicating paper.			124
TFS acquires customers, employees of Integrex.			232
The show must go on.	Bastin, Lisa Hamburg		642
Thermal repeatability in lead-free array rework: a recent study on thermal repeatability shows how even small changes in process variables can have a significant impact on the end result in lead-free array rework.	Brown, Craig		1633
Total process control and management, part I: from reliability, stability and traceability to predictability.	Kauss, Dan		2982
Universal, Hitachi extend high-speed placement collaboration.			153
What electronics manufacturing will remain in North America?			325
www.circuitsassembly.com/bg_intro.			109