Articles from Circuits Assembly (March 1, 2003)

1-67 out of 67 article(s)

Title	Author	Type	Words
"Tool time" in rework: expect the unexpected: common tools can be put to good use during rework.	Ferry, Jeff		783
AGA Chemical Inc. (Charlotte, NC), a subsidiary of Asahi Glass Co. (Tokyo, Japan), will launch domestic production of its AK-225 line of fluorinated solvents in the second quarter of 2003.		Brief Article	53
Applied Systems Intelligence.		Brief Article	45
Asia upswings with MEMS R&D and microsystems assembly.	Lutra, Mukul		1455
Atlanta SMTA Vendor Show open to exhibitors.		Brief Article	80
Automated magazine handling.			75
Automatic stencil printer.			82
BP Microsystems.		Brief Article	38
Checkmate: improving profitability through better use of process data; playing the manufacturing game correctly may result in increased productivity, reduced training costs and minimized failures.	Kazmierowicz, Philip C.		1734
Circuits Assembly online: www.circuitsassembly.com.		Brief Article	39
CirTran partners with SVI, receives initial Solectron order.		Brief Article	110
Component cleanliness in a no-clean world: a case study of component residues.	Munson, Terry		692
Connector grief? Today's inspection equipment must handle multiple pin heights within a connector and quickly identify defective pins.	Doyle, David		1369
December 2002 Book-to-Bill.		Brief Article	144
Desperate times ...	Hamburg, Lisa		700
Don't give me what I ask for: give me what I need: a guide to creating accurate RFQs.	Gordon, Pamela		942
Editorial forewarning brings nods of agreement.			369
Electronics assembler develops high-tech niche.		Brief Article	122
ESDA schedules S20.20 seminar.		Brief Article	160
Facility certification update: catching up on the ESD control program standard, S20.20.	Brandt, Michael T.		709
Finding BGA opens in production: a new method using AXI compares reflowed BGA ball sizes to detect open solder joints.	Leinbach, Glen		1512
Finding the right EMS provider.	Reese, Bill		38
Flux remover.			65
Free radicals: creative minds and new energy will enable market recovery.	Heimsch, Rich		556
Global Automation Inc.		Brief Article	26
How long until the next killer application? Will wireless products continue to drive semiconductor technology?	Vardaman, E. Jan		786
IMS wins Lockheed-Martin Supplier Award.		Brief Article	162
In-line stencil printer.			65
Indigo System Corp.		Brief Article	24
Industry resources.		Brief Article	116
Interchangeable inspection head.			62
IPC announces Electronics Assembly Scholarship Fund.			297
IPC releases APEX technical conference schedule.			110
ITT Industries, Cannon to acquire VEAM/TEC.		Brief Article	104
Legacy Electronics.		Brief Article	39
Les knows stencils.			241
Libra Industries.		Brief Article	27
LNL Technologies to develop optoelectronic chips.		Brief Article	139
March Plasma Systems.		Brief Article	38
Matrix Integrated Systems, Inc. (Richmond, CA) will install Mykrolis (Billerica, MA) mass flow controllers.		Brief Article	29
MSL, Videoton enter alliance.		Brief Article	150
Murrietta Circuits.		Brief Article	56
NEMI names Pfahl VP of operations.		Brief Article	118
OEM squeeze play: tougher terms for EMS players: how can EMS companies remain flexible in today's economy?	Mucha, Susan		1714
Off-line tooling system.			72
OPS selects OEM worldwide as new manufacturer.		Brief Article	77
Optical measurement system.			80
Packaging and surface-mount assembly software.			68
PCB cleaner.			68
Phihong.		Brief Article	44
Reflow atmospheres in the lead-free era: a recent study examined the effects of several process variables on tin/silver and tin/silver/copper solder pastes.	Mackie, Andy C.		2185
Reflow solder paste.			61
Sanmina receives ISO and TL certification, FDA approval.		Brief Article	128
Sanmina-SCI, IBM sign multibillion outsourcing agreement.		Brief Article	223
SMTA recognizes outstanding authors.			313
Stencil cleaner.			53
Stencil cleaning system.			81
Study analyzes market for flip chip, wafer-level packages.		Brief Article	286
Study: ten most attractive markets for MEMS/MST devices.			285
Surveys and guides.		Brief Article	59
Tecnomatix signs deals with Venture, Victron.		Brief Article	127
Teradyne signs Molex, partners with Kaparel.		Brief Article	196
ViTechnology.		Brief Article	23
Water-soluble solder paste.			54
Web sites worth mentioning.		Brief Article	109
Yamaichi Electronics USA.		Brief Article	26
You can't hang 'em out to dry; the rinse and dry steps are critical to the aqueous cleaning process.	Hymes, Les		652