Articles from Circuits Assembly (October 1, 2002)

1-60 out of 60 article(s)

Title	Author	Type	Words
Adhesive inspection system.		Brief Article	73
Alternative outsourcing, revised EMS forecast.		Brief Article	259
Auburn offers wireless engineering degree.		Brief Article	146
Bluetooth gaining momentum.		Brief Article	199
Catalyst introduces lead-free packages.		Brief Article	81
CEMS 2002 forecast grim.			342
ChipPAC to double capacity in China.	Shedd, John	Brief Article	150
Circuit Assembly online: www.circuitsassembly.com.		Brief Article	76
Cirrus Logic opens China design center.	Shedd, John	Brief Article	115
Coating removal methods: normally, removing a large QFF from a board would be easy, but what do you do with thick, clear, rubbery coatings?	Ferry, Jeff		832
Computer-aided production planning: a new, free software program enables supervisors to quickly and accurately calculate production line requirements.	Senawaitis, Anthony J.		409
Correction.		Correction Notice	47
CSP and flip chip assembly using tacky flux: a recent research project found how placement accuracy of CSPs and flip chips is affected by the component pitch and board layout.	Emmen, Hans		1770
DEK (Flemington, NJ) has expanded its stencil and custom-tooling capabilities by acquiring Acumen Technology (San Jose, CA), which operates stencil and fixture manufacturing facilities throughout the U.S., Mexico, Singapore and Malaysia.	Hamburg, Lisa	Brief Article	90
Depaneling system.		Brief Article	56
Desoldering ribbon.		Brief Article	79
Digital soldering station.		Brief Article	81
El Salvador attracts foreign investment.		Brief Article	241
Ensuring reproducibility in selective soldering: quality tools like FMEA and machine capability analysis are needed for effective process control of selective soldering.	Schouten, Gert		2750
Fujikura develops multi-layer FPC.	Shedd, John	Brief Article	119
High activity solder paste.		Brief Article	91
Hitachi America, Ltd.		Brief Article	43
IPC opens China office.	Shedd, John	Brief Article	165
July book-to-bill.		Brief Article	107
Linking the factory office to the factory floor: the correct documentation control system can increase productivity and quality while reducing costs.	Spera, Jason		1718
Living large: building big, bad backpanels: how are these monsters produced? Phil explains the processes and the equipment.	Zarrow, Phil		797
Matsushita develops new surface mounting technology.		Brief Article	289
Mexico versus China.	Murray, Jerry		506
Mexitronica 2002: the national electronics manufacturing conference and exposition of Mexico.		Brief Article	658
MLF assembly challenges: high-yield MLF assembly is possible with proper process controls.	Westby, George		722
MSL to expand network to Mexico.		Brief Article	86
Northrop Grumman executive to address IPC Annual Meeting.		Brief Article	147
Oki facilities achieve zero emissions.	Shedd, John	Brief Article	197
Optical inspection system.		Brief Article	94
PCB West/HDI Expo moves to San Jose in 2003.		Brief Article	151
Printing system.		Brief Article	46
Programming system.		Brief Article	66
Qualcon.	Hamburg, Lisa	Brief Article	53
Rework system.		Brief Article	93
Rework system.		Brief Article	70
Searching for the perfect BOM: a NEMI team comprised of OEMs and EMS providers offers recommendations for improving bills of materials.	McElroy, Jim		2336
Selective soldering tool.		Brief Article	47
SMTA announces Hutchins Grant recipient.		Brief Article	262
SMTA.	Hamburg, Lisa	Brief Article	117
Solectron China promotes Chen.	Shedd, John	Brief Article	76
Survival of the adaptive.	Hamburg, Lisa		617
Tape splicer.		Brief Article	54
The biennial European conference, Brighton 2002, sponsored by The SMART Group (Buckinghamshire, United Kingdom), will take place November 19-21, 2002, at the Old Ship Hotel in Brighton, United Kingdom.	Hamburg, Lisa	Brief Article	55
The devil's in the details: tombstoning revisited: you've checked the oven, the oven profiles, the solder paste and the nitrogen levels--why are you still encountering tombstoning?	Hymes, Les		687
This month's industry resources.		Brief Article	98
Thousands expected to attend electronica 2002.		Brief Article	135
Universal Instruments.		Brief Article	57
Valeo moves capacity to Chihuahua.	Shaughnessy, Andy		350
Valor set to deploy software.		Brief Article	112
Vectron, Inc.		Brief Article	40
Water-soluble solder paste.		Brief Article	35
Wave and Reflow Soldering Workshop.		Brief Article	158
Web sites worth mentoring.		Brief Article	95
When is a standard not a standard? Not all standards are equal.	Crawford, Jack		934
Wire stripping module.		Brief Article	106