Articles from Circuits Assembly (March 1, 2002)

1-63 out of 63 article(s)

Title	Author	Type	Words
Adhesive dot inspection system.		Brief Article	75
Advanced Research Technologies.		Brief Article	24
AIM expands in Australia.	Shedd, John	Brief Article	120
Anxious, yet optimistic.	Hamburg, Lisa		699
Beng selects Motorola software solution.	Shedd, John	Brief Article	249
Beware of "dry joints" and bad glue: solderability is key when avoiding "dry joints.".	Hymes, Les		552
Chip encapsulant.		Brief Article	82
Circuits Assembly online: www.circuitassembly.com.		Brief Article	30
Component handling system.		Brief Article	102
Customer satisfaction drives business success: participants of the 2002 SEAs for equipment and software suppliers allowed their customers to judge their performance--and reaped the benefits.	Yos, Narith		785
CyberOptics Corp.		Brief Article	57
DDi Corp.		Brief Article	79
December book-to-bill.		Brief Article	200
Electronics sales to increase in 2002.			363
Events calendar.			319
FeinFocus and Siemens Dematic form alliance.		Brief Article	98
Firm established to aid EMS providers.		Brief Article	276
Flextronics acquires operations from TeraForce.	Shedd, John	Brief Article	252
Gould Electronics, Inc.		Brief Article	48
GSI Lumonics, Inc.		Brief Article	41
Heller Industries (Florham Park, NJ) and ECD Inc. (Milwaukee, OR) announce that ECD's AutoM.O.L.E.[R] Xpert System can now be shipped as an option with all Heller reflow soldering ovens.		Brief Article	86
IBM and Sanmina-SCI sign agreement.			374
IMAPS issues call for papers.		Brief Article	128
Improving the Flash value stream with new technologies: inline systems provide just-in-time programming of Flash memory devices, improving production line throughput and increasing yields.	Boone, D. Judd		2311
Inspection system.		Brief Article	91
Interconnection device.		Brief Article	44
International Rectifier.		Brief Article	78
Ionizers.		Brief Article	79
IPC.		Brief Article	58
JEDEC.		Brief Article	50
Lamina Ceramics, Inc (Princeton, NJ), which employs proprietary technology to bond unfired ceramic to metal for use in communications and electronic components and packaging, has obtained $12 million in venture capital funding from Morgenthaler (Menlo Park, CA), a national venture capital firm, as well as from a major communications systems vendor.		Brief Article	107
Laser cut stencils.		Brief Article	67
Low stress adhesives.		Brief Article	82
Magnetic module.		Brief Article	47
Managing quick-turns: the prototype assembly stage doesn't have to riddle a project with delays.	Hackathorn, Mark		766
Managing your ESD program: implementing an ESD control program is important, and the results can make a tremendous difference in a facility's success.	Brandt, Michael T.		685
Micro valve.		Brief Article	108
Miniature inductors.		Brief Article	110
NEA Inc. (Londonderry, NH), a provider of reconditioned PCB assembly equipment, has signed an agreement with Speedline Technologies (Franklin, MA) to market and sell their remaining inventory of demo model UP 500 screen printers.		Brief Article	63
NEC and Celestica expand relationship.		Brief Article	229
New no-lead solder pastes and reflow techniques: a new study evaluated the performance of SnAgBi and SnAgCu alloys with bare copper and immersion tin pad finishes.	Heller, David		957
OEMs slow to share business systems.		Brief Article	211
Optic modules.		Brief Article	80
Optimizing printer-based solder paste inspection: a 2-D inspection system combined with SPC can improve PCB quality and increase profitability.	O'Neal, Dennis		2089
Outlook for 2002: prospects for a brighter end: when will business improve, and what are the bright spots in the electronics sector?	Vardaman, E. Jan		965
Preheaters.		Brief Article	75
Service Excellence Awards winners announced at APEX 2002.	Collins, Holly		517
SMTA announces Technical Committee.		Brief Article	132
SMTA mobile classroom visits Toronto.		Brief Article	155
Socket assembly.		Brief Article	131
Speakers at the recent SMTA International were awarded $1,000.00 and plaques for Best of Conference Paper, Best of Proceedings Paper and Best International paper.		Brief Article	52
Surveys and guides.		Brief Article	17
Test fixture.		Brief Article	79
The unkindest cut of all: performing etch cuts in external and internal connections can be simple or extremely complex.	Ferry, Jeff		788
This month's Industry Resources.		Brief Article	76
This month's shareware preview.		Brief Article	37
Through-hole rework of thermal dissipating assemblies: step-by-step instructions are given for a new method of reworking expensive through-hole heat sink assemblies.	Wachter, Ronald		1388
TVS arrays.		Brief Article	85
Used equipment vs. new asking the right questions: depending on your company's needs, used assembly equipment can often be a better buy than brand new equipment.	O'Neil, Steve		1970
Web sites worth mentioning.		Brief Article	106
Wire cutter.		Brief Article	88
X-ray inspection system.		Brief Article	94
Zuken backs government initiative on PCB design.	Shedd, John	Brief Article	241