Articles from Circuits Assembly (July 1, 2002)

1-65 out of 65 article(s)

Title	Author	Type	Words
A.P.E. South.		Brief Article	76
Adept and DEK announce partnership.	Seelig, Karl	Brief Article	129
Aegis Industrial Software Corporation.		Brief Article	68
Amtech.		Brief Article	86
April PCB stats.		Brief Article	341
Area array rework--size does matter! Out with the old manual rework practices. CSPs and flip chips require new automated techniques.	Naugler, Don		2608
Array package rework--lead free throws a curve: correct reflow profiles and automated equipment are the keys to successfully reworking array packages.	Rupprecht, Howard		2500
ASYS Automation.		Brief Article	86
Automated workcell solution.		Brief Article	106
Circuits Assembly online: www.circuitassembly.com.		Brief Article	84
Component mounter.		Brief Article	102
Conference on Lead-Free creates debate.	Seelig, Karl	Brief Article	443
Conference overview.		Brief Article	163
Cookson Electronics.		Brief Article	43
Creation Technologies.		Brief Article	47
CSP implementation: successful execution begins with design.	Beddingfield, S. Craig		682
Data I/O.		Brief Article	75
DEK.		Brief Article	51
Desco Industries, Inc. (Chino, CA) has acquired the Protektive Pak division of Brick Container Corp. (La Mirada, CA).		Brief Article	61
Digi-Key.		Brief Article	62
Ekra.		Brief Article	83
Electronic tactile sensor.		Brief Article	89
EMS suppliers look to India.	Shedd, John	Brief Article	298
EMS symposiums.			249
ESD hand lotion.		Brief Article	99
ETP releases report on IC Packaging Market.			390
Events calendar.		Brief Article	306
Flextronics and Casio enter partnership.	Shedd, John	Brief Article	147
GM and Ford executives to speak at ATExpo.		Brief Article	159
GNP Computers, Inc.		Brief Article	38
In-circuit test system.		Brief Article	125
Indium.		Brief Article	88
IPC (Northbrook, IL) has named Doug Sober as the new chairman of the Technical Activities Executive Committee (TAEC).		Brief Article	69
IPC.		Brief Article	48
Is it clean? Why do you want to know? Part I: do you sometimes battle with your customers over cleanliness?	Hymes, Les		672
Kester solder.		Brief Article	76
Legend and markings repair: boards with damaged legends or markings aren't necessarily destined for the scrap bin--three IPC-approved methods can help.	Ferry, Jeff		679
MEMS for mobile communications: packaging systems for MEMS have very specific requirements, hermetic sealing thermal and mechanical stability.	Silanto, Samuli		1473
MEMS long-term outlook is positive.		Brief Article	97
Metcal.		Brief Article	78
Microsoft Corp. (Redmond, WA) and manufacturing partner Flextronics Corp. (Singapore) have announced plans to establish a manufacturing and assembly operation for the Xbox[TM] video game system in China later this year.		Brief Article	71
Nilfisk-Advance America, Inc.		Brief Article	52
North America's manufacturing future: will North American facilities survive the shift to overseas manufacturing?	Vardaman, E. Jan		973
OMG.		Brief Article	69
Opening session and annual meeting.		Brief Article	233
Optical inspection system.		Brief Article	135
Optical transceivers.		Brief Article	95
Phoenix/x-ray Systems + Services.		Brief Article	77
Qualitek expands in Asia.	Shedd, John	Brief Article	85
Rework System.		Brief Article	127
Screening for errors: what's to blame? Stencil printer verification procedures allow production problems to be quickly isolated and corrected.	O'Hanlon, Michael		1850
Senior executive retreat offered.		Brief Article	94
Sharpe comments on Cookson repositioning.	Hamburg, Lisa	Interview	518
Solder fillet inspection system.		Brief Article	120
Solectron expands services in China.	Shedd, John	Brief Article	143
Substrate support system.		Brief Article	74
Surface-Mount Solder attachments: due to questionable test regimens and extravagant claims, IPC developed a standard to ensure proper solder joint reliability tests.	Engelmaier, Werner		1312
The precious metal activities of Degussa Galvanotechnik AG (Schwabisch Gmund, Germany) have been successfully integrated into OMG (Cleveland, OH) and will now be known as OMG Galvanotechnik GmbH.		Brief Article	49
This month's industry resources.		Brief Article	99
Toppan and NEC to integrate board operations.	Shedd, John	Brief Article	136
Vitronics Soltec North America.		Brief Article	77
Web sites worth mentioning.		Brief Article	138
Well, it sure didn't feel mild.	Hamburg, Lisa		596
Women in Electronics.	Hamburg, Lisa	Brief Article	77
X-Ray inspection system.		Brief Article	99