Articles from Circuits Assembly (January 1, 2002)

1-61 out of 61 article(s)

Title	Author	Type	Words
0201s: an inspection nightmare? Both optical and x-ray inspection should be used to reduce scrap and rework in assembling 0201s.	Butani, Vikram		1431
2002 salary survey questionnaire.			149
Actuators.			72
APEX and Expo may be co-located.		Brief Article	139
API taps component replacement market.		Brief Article	184
Aqueous cleaning system.			63
Assembleon and Cookson announce alliance.		Brief Article	158
Automated inspection system.			76
Brady reports first quarter earnings.		Brief Article	217
CA and TFI partner to present awards.		Brief Article	160
CCGA design variables and their effects on reliability: using full array, thin ceramic substrates and lidless packages can improve the thermal cycle fatigue life of CCGAs.	Milkovich, Cynthia		3265
Component placers.			69
Counting scales.			75
Custom trays.			51
Defense electronics boosts advanced packaging: recent events have helped to increase the need for advanced packaging technology in military applications.	Vardaman, E. Jan		773
Depaneler.			41
Digital camera.			73
DuPont and Cambridge sign agreement.		Brief Article	182
Elcoteq builds new plant in Beijing.	Shedd, John	Brief Article	242
Elcoteq Network Corp.		Brief Article	59
Flextronics to acquire stake in Orbiant.	Shedd, John	Brief Article	153
Flip chip fluxes.			70
Forced convection oven.			70
Going mainstream with chip-on-board: successfully merging COB with surface mount requires controlling a new set of complex variables related to the wire bonding process.	Luthra, Mukul		4225
GSI Lumonics, Inc.		Brief Article	39
Harting, Inc.		Brief Article	38
IMAPS.		Brief Article	48
Improving the reflow process with SPC: a successful SPC program can identify potential problems in the reflow process, thereby reducing rework costs.	Worsley, Charles		2340
In-line marking machine.			64
Lead-free solder paste.			65
Managing CSP underfill processes: the inherent slowness of underfill flowout can be masked to improve throughput.	Murch, Frank		1894
Manual Flash programmer first to offer network control.			602
MEMS enter rapid growth phase.			279
Motorola, Inc.		Brief Article	23
New courses offer variety.		Brief Article	174
October book-to-bill.		Illustration	201
Parts shortages to come.	Scouras, Ismini		342
PCB West 2002 issues call for papers.			132
Placement capability: an update of IPC's Surface-Mount Equipment Characterization standard sets the record straight.	Crawford, Jack		599
Plastic packages.			62
Potting compound.			97
Remember Baby Bear! Just like Baby Bear's porridge from the classic tale, water used in the cleaning process should be neither too hot nor too cold.	Hymes, Les		660
Rework system.			93
Safety in numbers.	Hamburg, Lisa	Editorial	815
Screen printing system.			94
Shirley, Mehlman to deliver keynote address.		Brief Article	183
Siix opens four new facilities.	Shedd, John	Brief Article	233
Solectron and NEC announce partnership plans.	Shedd, John	Brief Article	171
Solectron announces agreement with Microsoft.		Brief Article	182
Solutions in solder paste: new stencil developments make the BGA rework process more reliable.	Ferry, Jeff		694
Speedline announces distribution partner.		Brief Article	109
Stencil roll.			78
Stereo-zoom microscope.			83
Surveys and guides.			39
Swabbing it clean: how clean are your cleaning materials?	Munson, Terry		448
Technical conference tackles industry issues.		Brief Article	157
Tecnomatix enters agreement with NMTronics.	Shedd, John	Brief Article	90
This month's industry resources.			68
Web sites worth mentioning.			81
Wrist straps.			82
X-ray inspection system.			101