Articles from Circuits Assembly (August 1, 2001)

1-46 out of 46 article(s)

Title	Author	Type	Words
2002 SEAs Combining Programs; Accepting Participants.			222
5 Steps to Successful Lead-Free Soldering: Step 5.	Diepstraten, Gerjan	Brief Article	2345
Amkor's China Factory Begins Qualification.	Shedd, John	Brief Article	152
AOI and Real-Time SPC for High-Mix/Low-Volume Lines -- The combination of AOI and closed loop, real-time feedback offers significant benefits to today's diverse production lines.	Ayoub, George T.	Brief Article	1479
AOI: Do You Need Color? -- Black-and-white AOI systems may offer distinct advantages in viewing components and boards.	Wyllie, Glenn		1626
Book-to-Bill Increases Slightly.		Brief Article	125
Celestica Acquires Primetech and Omni; Partners with SAGEM SA.		Brief Article	233
Choosing an Automated Inspection Strategy -- AOI and AXI are viable and often complementary inspection technologies to use in PCB assembly.	Molamphy, Tom		1588
Component Feeder.		Brief Article	99
Continuing Education in Surface-Mount Technology -- Increasing your knowledge base could mean the difference between remaining in your current position and skipping a couple of rungs on your way up the corporate ladder.	Zarrow, Phil		893
Counting Scales.		Brief Article	83
CP, Ju Li and FIH Form Agreement.	Shedd, John	Brief Article	131
Damage-Free Pad Removal -- A proven method of circuit removal on modern base material.	Ferry, Jeff	Brief Article	686
Denver-Area Electronics -- Yeah, it's Cow Country. But that's high-tech Cow Country to you.	Hamburg, Lisa	Brief Article	974
Do Your Homework -- When changing materials, methods or tools, examine the total process-impacts can be observed upstream, as well as downstream, of the change.	Hymes, Les	Brief Article	750
European Council Adopts Waste, Hazardous Substance Directives.	Hamburg, Lisa	Brief Article	641
Feeder Carts.		Brief Article	96
FIBEROPTIC Automation Expo Debuts at Show.		Brief Article	150
Fine-Pitch Assembler.		Brief Article	72
Focus on Optoelectronics.			105
Functional Test in a High-Density PCB Environment -- Careful design, a well-planned test strategy and the proper tools will provide credible functional test results.	Stasonis, Bob	Brief Article	1853
IEST Accepting Abstract Submissions.			200
In Brief.		Brief Article	170
Industry Gears Up for Productronica 2001.		Brief Article	156
Japan's Economy Slows as Yen Rises.	Shedd, John	Brief Article	448
Measurement System.		Brief Article	72
Meeting Features Solectron's Nishimura; Awards.		Brief Article	181
New Optoelectronics Conference.			125
Odd-Form Automation System.		Brief Article	66
People.		Brief Article	172
Potting Compound.		Brief Article	113
Process Assessment: Part II -- Additional case study results show that fabrication residues can wreak havoc on electrical performance.	Munson, Terry	Brief Article	472
Repair Station.		Brief Article	126
Sandblaster.		Brief Article	85
SMTA International Overview.		Brief Article	305
Solder Extractor.		Brief Article	76
Solder Paste.		Brief Article	89
Solectron to Acquire Shinei Sangyo.	Shedd, John	Brief Article	85
Stereo Microscope.		Brief Article	101
Taking in the Trash.	Hamburg, Lisa	Brief Article	752
The Cluster Approach for In-Circuit and Functional Testing -- The cluster approach can improve testing efficiency and reduce broken pile for OEMs and EMS providers.	Ligai, Slav	Brief Article	2118
Theta Group Expands.	Shedd, John	Brief Article	86
TMRC Highlights: Is the Worst Behind Us?	Hamburg, Lisa		1492
Vision Inspection System.		Brief Article	76
Web-Based Tester Training.		Brief Article	110
X-Ray Inspection System.		Brief Article	118