Chipworks Investigates Intel's First Copper Chip.

Business Editors

OTTAWA--(BUSINESS WIRE)--Oct. 4, 2001

CHIPWORKS

Chipworks Uncovers the Most Advanced Process Technology Currently

Used in Any Microprocessor

Chipworks Inc., a world-class leading supplier of reverse engineering services for the semiconductor and electronics market, today discloses the technical innovation of the Intel Pentium III 0.13 micron all copper process technology.

Just over a year since the first Pentium III was released, Intel has re-launched the device changing its architecture from the 0.18 micron manufacturing process to 0.13 micron technology utilizing copper metalization. "The Intel 0.13 micron all copper interconnect process is reported to consume up to 40% less power and is up to 20% faster than the previous 0.18 micron process" stated Dave York, Chipworks' manager of process analysis.

The processor integrates the P6 Dynamic Execution micro-architecture, Dual Independent Bus (DBI), a multi-transaction system bus and the Intel(R)MMX(TM) media enhancement technology. It also features Intel's SpeedStep technology that enables one to automatically switch between maximum performance and optimal battery modes. A 32K (16K for infrastructure and 16K for data) primary or Level 1 cache array is also employed along with a 512K unified, non-blocking, Level 2 cache or a 256K Advanced Transfer L2 cache."

The device is manufactured in a full CMP, 0.13 micron process (0.07 micron gate lengths) with six levels of damascene copper and one level of polysilicon. It uses STI (Shallow Trench Isolation) and twin wells in a P- epi on a P substrate. Cobalt silicide is employed on the polysilicon and diffusions (salicide process). Intel indicates that the 0.07-micron transistors have a gate oxide thickness of 15 Angstroms.

According to Mr. York, "This chip is important for two reasons. First, it represents Intel's first implementation of a product using an all copper interconnect process. Second, this device utilizes some of the smallest gate lengths we have seen to date on any product."

Analysis of the metal interconnect layers was achieved with X-ray Energy Dispersive Spectroscopy (EDS) and the chemical composition of the dielectric layers was analyzed using Secondary Ion Mass Spectroscopy (SIMS). Cross-sectional analysis of the device structure was performed using a Field Emission Scanning Electron Microscope (FESEM) and a Transmission Electron Microscope (TEM). Complete findings are disclosed in a Structural Analysis Report released in September.

About Chipworks Inc.

Chipworks is an internationally recognized technical services company that analyzes the circuitry and physical composition of semiconductors devices and electronic systems for a wide range of applications in intellectual property licensing, patenting and competitive study. Chipworks has successfully helped leading-edge semiconductor and electronics organizations achieve their goals by supporting research and development efforts in strategic product development and patent portfolio management. Chipworks can be visited via the Internet at www.chipworks.com.