ChipPAC Standardizes on eRoom Solution; Deploys Global Automated Design Scheduling System.

Business/Technology Editors

CAMBRIDGE, Mass.--(BUSINESS WIRE)--Jan. 28, 2002

eRoom Technology, Inc., a leading provider of digital workplaces for extended enterprise collaboration, announced today that ChipPAC, Inc. (Nasdaq: CHPC), has standardized on the eRoom(R) solution and deployed an automated design scheduling system for its worldwide semiconductor packaging assembly and test business.

The Web-based eRoom digital workplace provides an easily accessible collaborative environment for sharing packaging information and design specifications between design centers, as well as with manufacturing and sales facilities located around the world. ChipPAC will now be able to consolidate the process of scheduling and managing custom packaging projects across multiple continents, resulting in more efficient work processes, improved workload management and even better, faster service for its Fortune 500 clients.

"Given our global scale, it was imperative that we were able to seamlessly connect the design efforts at all of our facilities," said Bret Zahn, vice president of Worldwide Design and Characterization at ChipPAC, Inc. "eRoom has helped make our proprietary SmartDESIGN(TM) system one of the most powerful solutions in the industry and it allows us to provide our customers with a consistent, high quality experience regardless of where their packaging is being designed."

"Product design and development activities that span multiple locations and time zones require a level of collaboration that simply cannot be achieved by stitching together telephone, fax and e-mail services," said Jeffrey Beir, president and chief executive officer for eRoom Technology, Inc. "The eRoom solution was designed for the purpose of helping businesses reach out to their extended enterprise partners to conduct business around the globe. We are pleased to be working with ChipPAC as it implements a new breed of collaborative applications that redefine the meaning of global customer service."

About ChipPAC, Inc.

ChipPAC Inc. is a full-portfolio provider of semiconductor package design, assembly, test and distribution services. The company combines a history of innovation and service with more than a decade of experience satisfying some of the largest - and most demanding - customers in the industry. With advanced process technology capabilities and a global manufacturing presence spanning Korea, China, Malaysia and the United States, ChipPAC, Inc. has a reputation for providing dependable, high quality packaging solutions. For more information, visit the company's Web site, www.chippac.com.

About eRoom Technology

eRoom Technology is a leading provider of Internet-based software and services for collaboration among an organization's extended enterprise of employees, customers, suppliers and other partners. The company's eRoom product provides a digital workplace for the extended enterprise, allowing organizations to quickly assemble a project team wherever people are located and manage the collaborative activities that support their complex and rapidly-changing business projects and processes. Customers use eRoom digital workplaces to help get products to market faster, drive down production costs, enhance customer relationships and improve the work products that drive their businesses. The eRoom solution is used by more than 600 companies such as A.T. Kearney, Aventis Pharmaceutical, BIC, Bausch & Lomb, Compaq, Deloitte Consulting, EDS, Fenwick & West, Ford Motor Company, Hewlett-Packard, Ketchum, Pfizer, Pharmacia, Philips, Siemens, Solectron and Sony. More information about eRoom Technology and its product offerings can be found at www.eroom.com.

Editor's Note: eRoom is a registered trademark of eRoom Technology, Inc. All other product and company names mentioned herein are trademarks of their respective owners.