ChipPAC Opens Customer Packaging Development Center for Prototype Evaluation and Fast-Turnaround Delivery.

SANTA CLARA, Calif.--(BUSINESS WIRE)--Feb. 4, 1999--ChipPAC, a leader in the IC assembly and test industry, has announced the opening of a customer packaging development center that will let companies evaluate BGA/CSP packaging options and take delivery of packaged integrated circuit prototypes within 5 working days or less.

The facility is located at the company's Santa Clara, California, headquarters.

By delivering prototypes within less than a week, ChipPAC customers can evaluate and debug their silicon with advanced packaging options. The facility allows engineers to have several iterations of prototypes in order to achieve full silicon performance prior to scheduling production. With this feedback, engineers can determine their packaging selections and the performance of their chips within those packages. The prototyping stage can efficiently allow customers to enter the production phase more seamlessly.

ChipPAC's facility provides wire-bonded and flip-chip BGA/CSP packages -- integrated-circuit packaging options that offer increased performance and reduction in package size.

"Matching the right package type to specific electrical parameters has become increasingly important as companies intensify the functionality on a single piece of silicon," stated Dennis McKenna, president and CEO of ChipPAC, Inc. "This facility lets us support the systems-level solutions required by our customers.

"Traditionally, integrated device manufacturers (IDMs) have done their own package development. This local facility is a vital supplement to that internal capability because even the most advanced companies do not have the resources to stay abreast of the multitude of packaging options and divergent product applications," McKenna continued.

"The packaging development center also benefits fabless semiconductor companies. These companies gain fast access to leading-edge technologies that allow them to bring new packages to market quickly and efficiently," he said.

Facility

The package development facility occupies 3,000-square feet of production area, with a controlled clean environment classified as a Class 10,000 assembly area. Design, thermal and electrical modeling services are also offered at the facility.

Outside the production floor, the facility includes 1,000-square-feet of secured guest-offices for customers and a conference room.

About ChipPAC

ChipPAC is one of the few assembly-and-test companies in the world that is a full-portfolio supplier. The company offers a full array of packaging, from basic 8-pin to 2000-pin packages in wire-bond and flip-chip interconnect solutions. The company has 3500 employees worldwide, with sales offices in Boston, Dallas, Phoenix, San Diego, Santa Clara, Japan, Korea, Singapore, and The Netherlands. ChipPAC's ISO 9002-certified manufacturing facilities are located in Ichon, Korea and Shanghai, China. Worldwide headquarters are located in Santa Clara, CA. Additional information about ChipPAC is available on the worldwide web at http://www.chippac.com.

ChipPAC, 3151 Coronado Drive, Santa Clara, CA 95054 Tel: [phone] Fax: [phone]