ChipPAC Inc. Is Now Offering EconoLGA, a Land Grid Array Package, In Its CSP Family of Packages to Address the Booming Wireless Markets.Business Editors & High-Tech Writers SANTA CLARA, Calif.--(BUSINESS WIRE)--June 1, 2000 ChipPAC Inc., a leader in the subcontract assembly, packaging and test industry today announced that they are offering EconoLGA(tm) package. This land grid array The land grid array (LGA) is a type of surface-mount packaging used for integrated circuits. It can be electrically connected to a PCB either by the use of a socket or by soldering directly to the PCB. format package has the advantage of low profile added to the small foot print. The EconoLGA package is highly suitable for markets driven by lower size, higher features and functions at a reduced cost. Because of its land grid array format the total height is less than 1mm mounted, making it a suitable package for mobile applications like cell phones, PDA's, pagers and digital cameras. The package is targeted at PLLs, EEPROMs, NVRAM (Non-Volatile RAM) May refer to dynamic RAM (DRAM) and static RAM (SRAM) chips that are backed up by a battery or to non-volatile chips such as flash memory. See non-volatile memory, dynamic RAM, static RAM and solid state disk. , Flash, SRAM See static RAM. SRAM - static random-access memory and other RF Devices. The EconoLGA package utilizes a pancake approach to substrate architecture by molding all packages at once and then sawing them to obtain individual units. This eliminates the need for individually tooling each body size thus offering significant cost savings. The package features a thincore laminate substrate with 2 metal layers or a 1 metal layer tape substrate and is compatible with standard SMT (1) (Surface Mount Technology) See surface mount. (2) (Station ManagemenT) An FDDI network management protocol that provides direct management. Only one node requires the software. SMT - Station Management assembly processes and techniques. "Adding EconoLGA to our CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP. (2) (Commerce Service P family broadens the advanced packaging options we offer. These choices added with ChipPAC's leadership in packaging and its multiple source assembly and test capability give our customers value added options," said Satya Chillara, Director of Laminate products. The EconoLGA package is internally qualified, which is typically 1000 temp cycles at -65 to +150 degrees C, PCT (Private Communications Technology) A protocol from Microsoft that provides secure transactions over the Web. See security protocol. of 168hrs, JEDEC The division of the Electronic Industries Alliance (EIA) that deals with semiconductor standards (officially, the JEDEC Solid State Technology Association of EIA). JEDEC was formed in 1958 when the Joint Electron Tube Engineering Council (JETEC) split into two Joint Electron Device Level 2A and HTS @150 degrees C for 500hrs. The package is available in body sizes ranging from 2x2 to 10x10 mm with lands of up to 100 at 0.5 to 1.0mm pitches. Daisy chain units are available for certain body sizes upon request. ChipPAC has a total volume production in excess of 15M/Month units for this package type. This package is shipped in JEDEC trays or tape and reel. About ChipPAC Inc. ChipPAC Inc. is one of the few assembly and test companies in the world that is a full-portfolio supplier. The company offers a full array of packaging, from basic 2-pin to 2000-pin BGA/CSP and leaded packages. These packages are offered in wire-bond and flip-chip processes. The company, which will be 6800 employees strong worldwide with soon to be acquired facility in Kuala Lumpur, Malaysia, has sales offices in Boston, Dallas, Phoenix, San Diego, Santa Clara, Japan, Korea, Singapore and The Netherlands, and ISO (1) See ISO speed. (2) (International Organization for Standardization, Geneva, Switzerland, www.iso.ch) An organization that sets international standards, founded in 1946. The U.S. member body is ANSI. 9002-certified manufacturing facilities located in Ichon, Korea and Shanghai, China. ChipPAC headquarters are at 3151 Coronado Dr., Santa Clara, CA 95054, 408/486-5900. ChipPAC Inc. is first in Shaping Solutions(tm). Visit www.chippac.com for complete information. |
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