ChipPAC Enhanced Plastic Ball-Grid Array Delivers Superior Electrical Performance for Systems on Chips.

SANTA CLARA, Calif.--(BUSINESS WIRE)--April 19, 1999--

ChipPAC, Inc. has announced availability of a new enhanced plastic ball-grid array (EPBGA) designed to provide superior electrical performance in complex designs, including systems on chips and application-specific integrated circuits (ASICs).

The EPBGA is a fine-pitch wire-bonded package that utilizes a 4-layer substrate with power and ground planes for thermal and electrical performance. The packages are available in 300- to 800-pin counts and package sizes of 35- to 45mm. Staggered bond pads of 45- to 90um are available now on the EPBGA, with 40- to 80um staggered bond pads expected later this year. These specifications allow the EPBGA to deliver high performance and accommodate high frequency levels for devices with medium- to high-I/O counts.

Satya Chillara, ChipPAC director of marketing, said, "ChipPAC's strategy is to provide quality, cost-effective packages with performance characteristics matched to today's most innovative IC solutions. The EPBGA is another package that addresses the high-end packaging needs of our target customers."

Ideal applications for EPBGAs include ASICs, programmable logic devices (PLDs), digital signal processors, and graphics controller chips. Target market applications include routers and switches in networking and workstations and servers in the high-end computing arenas.

The EPBGA is fully qualified and in volume production now. Pricing is available by contacting the company.

ChipPAC is one of the few assembly-and-test companies in the world that is a full-portfolio supplier. The company offers a full array of packaging, from basic 8-pin to 2000-pin packages in wire-bond, ball-grid array, chip-scale packaging, and flip-chip interconnect solutions. The company has 3500 employees worldwide, with sales offices in the United States, Japan, Korea, Singapore, and The Netherlands. ChipPAC's ISO 9002- and QS9000-certified manufacturing facilities are located in Ichon, Korea and Shanghai, China. Worldwide headquarters are located in Santa Clara, CA. Additional information about ChipPAC is available on the worldwide web at http://www.chippac.com.

ChipPAC 3151 Coronado Drive Santa Clara, CA 95054 Tel: [phone] Fax: [phone]